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TPS65735

AKTIV

Power-Management-IC (PMIC) für 3D-Brillen mit Active Shutter

Produktdetails

Regulated outputs (#) 2 Step-down DC/DC converter 0 Step-up DC/DC converter 1 LDO 1 Vin (min) (V) 2.5 Vin (max) (V) 6.5 Vout (min) (V) 2.2 Vout (max) (V) 16 Iout (max) (A) 0.15 Features Power good, Power sequencing Rating Catalog Operating temperature range (°C) -40 to 85 Step-down DC/DC controller 0 Step-up DC/DC controller 0 Iq (typ) (mA) 0.0086 Product type Processor and FPGA
Regulated outputs (#) 2 Step-down DC/DC converter 0 Step-up DC/DC converter 1 LDO 1 Vin (min) (V) 2.5 Vin (max) (V) 6.5 Vout (min) (V) 2.2 Vout (max) (V) 16 Iout (max) (A) 0.15 Features Power good, Power sequencing Rating Catalog Operating temperature range (°C) -40 to 85 Step-down DC/DC controller 0 Step-up DC/DC controller 0 Iq (typ) (mA) 0.0086 Product type Processor and FPGA
WQFN (RSN) 32 16 mm² 4 x 4
  • Linear Charger
    • Three Charger Phases: Pre-Charge,
      Fast Charge, and Charge Termination
    • Externally Set Charge Current Which Supports
      up to 100 mA
    • LED Current Sinks for Power Good and Charger
      Status Indication
  • Low-Dropout Regulator (LDO) Supply for External
    Modules (Microcontroller, RF Module, IR Module)
    • LDO Continuous Output Current up to 30 mA
  • Boost Converter
    • Adjustable Output Voltage: 8 V to 16 V
    • Boost Output Internally Connected to H-Bridge
      Analog Switches
  • Full H-Bridge Analog Switches
    • Controlled by an External Microcontroller for
      System Operation
  • Output Pin for Divided Down Battery Voltage
    Useful for ADC or Comparator Input of an MCU
  • Linear Charger
    • Three Charger Phases: Pre-Charge,
      Fast Charge, and Charge Termination
    • Externally Set Charge Current Which Supports
      up to 100 mA
    • LED Current Sinks for Power Good and Charger
      Status Indication
  • Low-Dropout Regulator (LDO) Supply for External
    Modules (Microcontroller, RF Module, IR Module)
    • LDO Continuous Output Current up to 30 mA
  • Boost Converter
    • Adjustable Output Voltage: 8 V to 16 V
    • Boost Output Internally Connected to H-Bridge
      Analog Switches
  • Full H-Bridge Analog Switches
    • Controlled by an External Microcontroller for
      System Operation
  • Output Pin for Divided Down Battery Voltage
    Useful for ADC or Comparator Input of an MCU

The TPS65735 device is a power management unit (PMU) for active shutter 3D glasses consisting of an integrated power path, linear charger, LDO, boost converter, and full H-bridge analog switches for left and right shutter operation in a pair of active shutter 3D glasses. In addition to the power devices, a typical 3D glasses system contains both a microcontroller and a communications front end (IR, RF, or other) in order to handle the communication and synchronous operation along with a 3D television.

The TPS65735 device is a power management unit (PMU) for active shutter 3D glasses consisting of an integrated power path, linear charger, LDO, boost converter, and full H-bridge analog switches for left and right shutter operation in a pair of active shutter 3D glasses. In addition to the power devices, a typical 3D glasses system contains both a microcontroller and a communications front end (IR, RF, or other) in order to handle the communication and synchronous operation along with a 3D television.

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Ähnliche Funktionalität wie verglichener Baustein
TPS65835 AKTIV Advanced Power-Management-IC (PMIC), mit integriertem MSP430 für 3D-Brillen mit Active Shutter This product has an intergated MSP430 MCU.

Technische Dokumentation

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Alle anzeigen 4
Typ Titel Datum
* Data sheet TPS65735 PMU for Active Shutter 3D Glasses datasheet (Rev. A) PDF | HTML 06 Jan 2016
Selection guide Power Management Guide 2018 (Rev. R) 25 Jun 2018
Application note Understanding the Absolute Maximum Ratings of the SW Node (Rev. A) 13 Jan 2012
User guide TPS65735 System Eval Board User's Guide 15 Jun 2011

Design und Entwicklung

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Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
WQFN (RSN) 32 Ultra Librarian

Bestellen & Qualität

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  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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