DS90CF364A
- 20 to 65 MHz Shift Clock Support
- 50% Duty Cycle on Receiver Output Clock
- Best-in-Class Set & Hold Times on RxOUTPUTs
- Rx Power Consumption <142 mW (typ) @65MHz Grayscale
- Rx Power-down Mode <200μW (max)
- ESD Rating >7 kV (HBM), >700V (EIAJ)
- Supports VGA, SVGA, XGA and Dual Pixel SXGA.
- PLL Requires no External Components
- Compatible with TIA/EIA-644 LVDS Standard
- Low Profile 56-lead or 48-lead Packages
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The DS90CF384A receiver converts the four LVDS data streams (Up to 1.8 Gbps throughput or 227 Megabytes/sec bandwidth) back into parallel 28 bits of CMOS/TTL data (24 bits of RGB and 4 bits of Hsync, Vsync, DE and CNTL). Also available is the DS90CF364A that converts the three LVDS data streams (Up to 1.3 Gbps throughput or 170 Megabytes/sec bandwidth) back into parallel 21 bits of CMOS/TTL data (18 bits of RGB and 3 bits of Hsync, Vsync and DE). Both Receivers' outputs are Falling edge strobe. A Rising edge or Falling edge strobe transmitter (DS90C383A/DS90C363A) will interoperate with a Falling edge strobe Receiver without any translation logic.
The DS90CF384A / DS90CF364A devices are enhanced over prior generation receivers and provided a wider data valid time on the receiver output.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | DS90CF384A/364A 3.3V LVDS Rcvr 24Bit FPD Link 65MHz/18Bit FPD Link - 65 MHz datasheet (Rev. I) | 2013/04/19 | |
Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018/11/09 | ||
Application note | How to Map RGB Signals to LVDS/OpenLDI(OLDI) Displays (Rev. A) | 2018/06/29 | ||
Application note | AN-1032 An Introduction to FPD-Link (Rev. C) | 2017/08/08 | ||
Application note | Receiver Skew Margin for Channel Link I and FPD Link I Devices | 2016/01/13 | ||
Application note | TFT Data Mapping for Dual Pixel LDI Application - Alternate A - Color Map | 2004/05/15 | ||
Application note | AN-1056 STN Application Using FPD-Link | 2004/05/14 | ||
Application note | AN-1085 FPD-Link PCB and Interconnect Design-In Guidelines | 2004/05/14 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (DGG) | 48 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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