DS90CF364
- 20 to 65 MHz shift clock support
- Programmable Transmitter (DS90C363) strobe select (Rising or Falling edge strobe)
- Single 3.3V supply
- Chipset (TX + RX) power consumption < 250 mW (typ)
- Power-down mode (< 0.5 mW total)
- Single pixel per clock XGA (1024×768) ready
- Supports VGA, SVGA, XGA and higher addressability
- Up to 170 Megabyte/sec bandwidth
- Up to 1.3 Gbps throughput
- Narrow bus reduces cable size and cost
- 290 mV swing LVDS devices for low EMI
- PLL requires no external components
- Low profile 48-lead TSSOP package
- Falling edge data strobe Receiver
- Compatible with TIA/EIA-644 LVDS standard
- ESD rating > 7 kV
- Operating Temperature: −40°C to +85°C
All trademarks are the property of their respective owners. TRI-STATE is a trademark of Texas Instruments. TRI-STATE is a trademark of Texas Instruments.
The DS90C363 transmitter converts 21 bits of CMOS/TTL data into three LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fourth LVDS link. Every cycle of the transmit clock 21 bits of input data are sampled and transmitted. The DS90CF364 receiver converts the LVDS data streams back into 21 bits of CMOS/TTL data. At a transmit clock frequency of 65 MHz, 18 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughput is 170 Mbyte/sec. The Transmitter is offered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The Transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge Transmitter will inter-operate with a Falling edge Receiver (DS90CF364) without any translation logic.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DS90C363/F364 3.3V Prog LVDS Trnsmit 18Bit FPD 65MHz/LVDS Rcvr 18Bit FPD 85MHz datasheet (Rev. C) | 2013年 4月 12日 | |
| Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018年 11月 9日 | ||
| Application note | How to Map RGB Signals to LVDS/OpenLDI(OLDI) Displays (Rev. A) | 2018年 6月 29日 | ||
| Application note | AN-1032 An Introduction to FPD-Link (Rev. C) | 2017年 8月 8日 | ||
| Application note | Receiver Skew Margin for Channel Link I and FPD Link I Devices | 2016年 1月 13日 | ||
| Application note | TFT Data Mapping for Dual Pixel LDI Application - Alternate A - Color Map | 2004年 5月 15日 | ||
| Application note | AN-1056 STN Application Using FPD-Link | 2004年 5月 14日 | ||
| Application note | AN-1085 FPD-Link PCB and Interconnect Design-In Guidelines | 2004年 5月 14日 |
設計與開發
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FLINK3V8BT-85 — 適用於 FPD-Link 系列之串聯器和解串器 LVDS 產品的評估套件
The FPD-Link evaluation kit includes a transmitter (Tx) board, a receiver (Rx) board and interfacing cables. This kit shows the chipsets interfacing from test equipment or a graphics controller using low-voltage differential signaling (LVDS) to a receiver board.
The transmitter board accepts (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (DGG) | 48 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
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建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。