DS90CF386
- 20-MHz to 85-MHz Shift Clock Support
- Rx Power Consumption <142 mW (Typical) at
85-MHz Grayscale - Rx Power-Down Mode <1.44 mW (Maximum)
- ESD Rating >7 kV (HBM), >700 V (EIAJ)
- Supports VGA, SVGA, XGA, and Single Pixel
SXGA - PLL Requires No External Components
- Compatible With TIA/EIA-644 LVDS Standard
- Low Profile 56-Pin or 48-Pin TSSOP Package
- DS90CF386 Also Available in a 64-Pin, 0.8-mm,
Fine Pitch Ball Grid Array (NFBGA) Package
The DS90CF386 receiver converts four LVDS (Low Voltage Differential Signaling) data streams back into parallel 28 bits of LVCMOS data. Also available is the DS90CF366 receiver that converts three LVDS data streams back into parallel 21 bits of LVCMOS data. The outputs of both receivers strobe on the falling edge. A rising edge or falling edge strobe transmitter will interoperate with a falling edge strobe receiver without any translation logic.
The receiver LVDS clock operates at rates from 20 MHz to 85 MHz. The device phase-locks to the input LVDS clock, samples the serial bit streams at the LVDS data lines, and converts them into parallel output data. At an incoming clock rate of 85 MHz, each LVDS input line is running at a bit rate of 595 Mbps, resulting in a maximum throughput of 2.38 Gbps for the DS90CF386 and 1.785 Gbps for the DS90CF366.
The use of these serial link devices is ideal for solving EMI and cable size problems associated with transmitting data over wide, high-speed parallel LVCMOS interfaces. Both devices are offered in TSSOP packages. The DS90CF386 is also offered in a 64-pin, 0.8-mm, fine pitch ball grid array (NFBGA) package which provides a 44% reduction in PCB footprint compared to the 56-pin TSSOP package.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90CF3x6 3.3-V LVDS Receiver 24-Bit Or 18-Bit Flat Panel Display (FPD) Link, 85 MHz datasheet (Rev. J) | PDF | HTML | 2016年 5月 31日 |
Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018年 11月 9日 | ||
Application note | How to Map RGB Signals to LVDS/OpenLDI(OLDI) Displays (Rev. A) | 2018年 6月 29日 | ||
Application note | AN-1032 An Introduction to FPD-Link (Rev. C) | 2017年 8月 8日 | ||
User guide | FLINK3V8BT-85 Evaluation Kit (Rev. A) | 2016年 8月 24日 | ||
Application note | Receiver Skew Margin for Channel Link I and FPD Link I Devices | 2016年 1月 13日 | ||
Application note | TFT Data Mapping for Dual Pixel LDI Application - Alternate A - Color Map | 2004年 5月 15日 | ||
Application note | AN-1056 STN Application Using FPD-Link | 2004年 5月 14日 | ||
Application note | AN-1085 FPD-Link PCB and Interconnect Design-In Guidelines | 2004年 5月 14日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
FLINK3V8BT-85 — 適用於 FPD-Link 系列之串聯器和解串器 LVDS 產品的評估套件
The FPD-Link evaluation kit includes a transmitter (Tx) board, a receiver (Rx) board and interfacing cables. This kit shows the chipsets interfacing from test equipment or a graphics controller using low-voltage differential signaling (LVDS) to a receiver board.
The transmitter board accepts (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
NFBGA (NZC) | 64 | Ultra Librarian |
TSSOP (DGG) | 56 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。