SN75372
- Dual Circuits Capable of Driving High-Capacitance Loads at High Speeds
- Output Supply Voltage Range up to 24 V
- Low Standby Power Dissipation
The SN75372 is a dual NAND gate interface circuit designed to drive power MOSFETs from TTL inputs. It provides high current and voltage levels necessary to drive large capacitive loads at high speeds. The device operates from a VCC1 of 5 V and a VCC2 of up to 24 V.
The SN75372 is characterized for operation from 0°C to 70°C.
技術文件
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檢視所有 9 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | SN75372 Dual MOSFET Driver datasheet (Rev. A) | 2023年 9月 22日 | |
| Application note | Why use a Gate Drive Transformer? | PDF | HTML | 2024年 3月 4日 | |
| Application note | Review of Different Power Factor Correction (PFC) Topologies' Gate Driver Needs | PDF | HTML | 2024年 1月 22日 | |
| Application note | Static Magnet Power Supply Design for Magnetic Resonance Imaging Application | PDF | HTML | 2024年 1月 22日 | |
| Application brief | External Gate Resistor Selection Guide (Rev. A) | 2020年 2月 28日 | ||
| Application brief | Understanding Peak IOH and IOL Currents (Rev. A) | 2020年 2月 28日 | ||
| Application note | Improving Efficiency of DC-DC Conversion through Layout | 2019年 5月 7日 | ||
| Application brief | How to overcome negative voltage transients on low-side gate drivers' inputs | 2019年 1月 18日 | ||
| Application brief | High-Side Cutoff Switches for High-Power Automotive Applications (Rev. A) | 2018年 11月 26日 |
設計與開發
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模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| PDIP (P) | 8 | Ultra Librarian |
| SOIC (D) | 8 | Ultra Librarian |
| SOP (PS) | 8 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點