TPS92665-Q1
- AEC-Q100 qualified for automotive applications
- Grade 1: –40°C to 125°C ambient temperature
- Device HBM classification level H1C
- Device CDM classification level C5
- Functional Safety-Capable
- Documentation available to aid functional safety system design
- 16 integrated bypass switches
- Programmable 10-bit PWM dimming
- Programmable slew rate control
- LED open detection and protection
- Single LED short detection
- UART serial communication
- Internal oscillator for system clock
- LVDS clock driver for synchronizing devices
- Previous LMM generation compatible
- CAN transceiver compatible
- Integrated ADC
- LED voltage for each switch
- Die temperature
- 2x general ADC inputs (thermistor compatible)
The TPS92665 LED matrix manager device enables fully dynamic adaptive lighting solutions by providing individual pixel-level LED control. The device includes four sub-strings of four series connected integrated switches for bypassing individual LEDs. The individual sub-strings allow the device to accept either single or multiple current sources.
The TPS92665 features an internal oscillator. The internal oscillator can be shared to other system devices through the internal low noise LVDS transmitter and receiver blocks. The multi-drop, universal, asynchronous, receiver transmitter (UART) serial interface is compatible with TPS92664, TPS92667, TPS92662x and TPS92663x devices. An on-board ADC with multiplexed inputs samples all LED channels as well as IC die temperature. The ADC also samples dedicated ADC inputs for use with system temperature compensation, LED binning and coding.
The TPS92665 incorporates registers for programming phase shift and pulse width of each individual LED in the string and for reporting LED open, short faults and functional parameters.
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TPS92667EVM-DESIGN — TPS92667 evaluation module design resources
支援產品和硬體
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTQFP (PHP) | 48 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。