首頁 電源管理 DC/DC 電源模組 電源模組 (整合式電感器)

TPSM53604

現行

採用小型 5.5 x 5 x 4mm 增強型 HotRod™ QFN 且具有簡單元件封裝的 36V、4A 降壓電源模組

現在提供此產品的更新版本

open-in-new 比較替代產品
功能相同,但引腳輸出與所比較的裝置不同
TPSM63604 現行 36-V 輸入、16-V 輸出、4-A 同步降壓 DC-DC 電源模組 Wider output voltage range, improved optimization for performance and ultra-low EMI

產品詳細資料

Rating Catalog Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Topology Buck, Inverting Buck-Boost, Synchronous Buck Type Module Iout (max) (A) 4 Vin (min) (V) 3.8 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 7 EMI features Low parasitic Hotrod packaging Features EMI Tested, Enable, Light Load Efficiency, Power good Control mode current mode Duty cycle (max) (%) 98
Rating Catalog Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Topology Buck, Inverting Buck-Boost, Synchronous Buck Type Module Iout (max) (A) 4 Vin (min) (V) 3.8 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 7 EMI features Low parasitic Hotrod packaging Features EMI Tested, Enable, Light Load Efficiency, Power good Control mode current mode Duty cycle (max) (%) 98
B3QFN (RDA) 15 27.5 mm² 5.5 x 5
  • Functional Safety-Capable
  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
    • Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided)
    • Low EMI: meets CISPR11 radiated emissions
    • Excellent thermal performance: up to 20 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603 and 2-A TPSM53602
  • Create a custom design using the TPSM53604 with the WEBENCH Power Designer
  • Download the EVM Design Files for fast board design
  • Functional Safety-Capable
  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
    • Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided)
    • Low EMI: meets CISPR11 radiated emissions
    • Excellent thermal performance: up to 20 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603 and 2-A TPSM53602
  • Create a custom design using the TPSM53604 with the WEBENCH Power Designer
  • Download the EVM Design Files for fast board design

The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.

The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.

下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
功能相同,但引腳輸出與所比較的裝置不同
TPSM63603 現行 高密度、3-V 至 36-V 輸入、1-V 至 16-V 輸出、3-A 電源模組 Lower output current and improved performance.
TPSM63606 現行 採用 5-mm x 5.5-mm 強化型 HotRod™ QFN 封裝的高密度、36-V 輸入、1-V 至 16-V 輸出、6-A 電源模組 Greater output current and improved performance.

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 11
類型 標題 日期
* Data sheet TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. C) PDF | HTML 2021年 9月 30日
Application note Soldering Considerations for Power Modules (Rev. C) PDF | HTML 2024年 3月 14日
White paper Addressing Factory Automation Challenges with Innovations in Power Design 2021年 9月 28日
Functional safety information TPSM53604 Functional Safety, FIT Rate, Failure Mode Distribution, and Pin FMA PDF | HTML 2021年 8月 24日
Technical article Powering medical imaging applications with DC/DC buck converters PDF | HTML 2020年 11月 24日
Application note Soldering Requirements for BQFN Packages (Rev. C) 2020年 3月 5日
Technical article 35 years later, APEC continues to set the tone for innovation in power management PDF | HTML 2020年 2月 27日
EVM User's guide Using the TPSM53604EVM, TPSM53603EVM, and TPSM53602EVM (Rev. B) 2019年 12月 13日
Application note Practical Thermal Design With DC/DC Power Modules (Rev. A) 2019年 11月 20日
White paper Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging 2019年 11月 19日
Application note Using the TPSM5360x for an Inverting Buck-Boost Application 2019年 10月 29日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TPSM53604EVM — 3.8-V 至 36-V 輸入、4-A 電源模組評估板

The TPSM53604 evaluation board (EVM) is configured to evaluate the operation of the TPSM53604 power module for current up to 4 A. The input voltage range is 3.8 V to 36 V. The output voltage range is 1 V to 7 V. The evaluation board makes it easy to evaluate the TPSM53604 operation.
使用指南: PDF
TI.com 無法提供
模擬型號

TPSM53604 PSpice Transient Model

SNVMC56.ZIP (387 KB) - PSpice Model
設計工具

SNVR482 TPSM53604 EVM Design Files

支援產品和硬體

支援產品和硬體

產品
電源模組 (整合式電感器)
TPSM53604 採用小型 5.5 x 5 x 4mm 增強型 HotRod™ QFN 且具有簡單元件封裝的 36V、4A 降壓電源模組
封裝 針腳 CAD 符號、佔位空間與 3D 模型
B3QFN (RDA) 15 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片