首頁 電源管理 DC/DC 電源模組 電源模組 (整合式電感器)

TPSM64406

現行

高密度、36V、0.8V 至 16V 輸出、雙 3A 輸出功率模組

產品詳細資料

Rating Catalog Operating temperature range (°C) -40 to 125 Topology Synchronous Buck Type Module Iout (max) (A) 3, 6 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 0.8 Vout (max) (V) 16 Switching frequency (min) (kHz) 400 Switching frequency (max) (kHz) 2100 EMI features Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum Features Dual output, EMI Tested, Frequency synchronization, Spread Spectrum, Ultra-low noise Control mode current mode Duty cycle (max) (%) 99
Rating Catalog Operating temperature range (°C) -40 to 125 Topology Synchronous Buck Type Module Iout (max) (A) 3, 6 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 0.8 Vout (max) (V) 16 Switching frequency (min) (kHz) 400 Switching frequency (max) (kHz) 2100 EMI features Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum Features Dual output, EMI Tested, Frequency synchronization, Spread Spectrum, Ultra-low noise Control mode current mode Duty cycle (max) (%) 99
QFN-FCMOD (RCH) 28 45.5 mm² 6.5 x 7
  • Versatile dual output voltage or multiphase single output synchronous buck module
    • Integrated MOSFETs, inductor, and controller
    • Wide input voltage range of 3V to 36V
    • Adjustable output voltage from 0.8V to 16V
    • 6.5mm × 7.0mm × 2mm overmolded package
    • –40°C to 125°C junction temperature range
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • Peak efficiency of 93.5%+
    • External bias option for improved efficiency
    • Exposed Pad for low thermal impedance. EVM θJA = 20 °C/W.
    • Shutdown quiescent current of 0.6µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Meets CISPR 11 and 32 Class B emissions
  • Designed for scalable power supplies
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM64406 with the WEBENCH Power Designer
  • Versatile dual output voltage or multiphase single output synchronous buck module
    • Integrated MOSFETs, inductor, and controller
    • Wide input voltage range of 3V to 36V
    • Adjustable output voltage from 0.8V to 16V
    • 6.5mm × 7.0mm × 2mm overmolded package
    • –40°C to 125°C junction temperature range
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • Peak efficiency of 93.5%+
    • External bias option for improved efficiency
    • Exposed Pad for low thermal impedance. EVM θJA = 20 °C/W.
    • Shutdown quiescent current of 0.6µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Meets CISPR 11 and 32 Class B emissions
  • Designed for scalable power supplies
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM64406 with the WEBENCH Power Designer

The TPSM6440xx is a highly integrated 36V input capable, DC/DC design that combines power MOSFETs, a shielded inductor, and passives in an enhanced HotRod™ QFN package. The device supports either dual output or high current single output using an interleaved, stackable, current-mode control architecture for easy loop compensation, fast transient response, excellent load and line regulation, and accurate current sharing with an output clock supporting up to 6 phases for currents up to 18A. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. A large thermal pad beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1V to 16V, the TPSM6440xx is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total design requires as few as six external components and eliminates the magnetics selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM6440xx module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, and spread spectrum for improved EMI. Along with integrated VCC, bootstrap and input capacitors for increased reliability and higher density. The module can be configured for constant switching frequency over the full load current range (FPWM), or variable frequency (PFM) for higher light load efficiency. Including a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

The TPSM6440xx is a highly integrated 36V input capable, DC/DC design that combines power MOSFETs, a shielded inductor, and passives in an enhanced HotRod™ QFN package. The device supports either dual output or high current single output using an interleaved, stackable, current-mode control architecture for easy loop compensation, fast transient response, excellent load and line regulation, and accurate current sharing with an output clock supporting up to 6 phases for currents up to 18A. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. A large thermal pad beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1V to 16V, the TPSM6440xx is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total design requires as few as six external components and eliminates the magnetics selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM6440xx module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, and spread spectrum for improved EMI. Along with integrated VCC, bootstrap and input capacitors for increased reliability and higher density. The module can be configured for constant switching frequency over the full load current range (FPWM), or variable frequency (PFM) for higher light load efficiency. Including a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 5
類型 標題 日期
* Data sheet TPSM6440xx 3V to 36V, Low IQ, Dual 2/3A Module Optimized for Power Density and Low EMI datasheet (Rev. A) PDF | HTML 2024年 6月 18日
Technical article 電源模組封裝類型及其優勢 PDF | HTML 2024年 8月 12日
EVM User's guide TPSM64406 4-Phase, 36V, Single 12A Output, Synchronous, Buck Module Evaluation Module User's Guide PDF | HTML 2024年 4月 5日
Certificate TPSM64406EVM-4PH EU Declaration of Conformity (DoC) 2024年 3月 13日
Certificate TPSM64406EVM EU Declaration of Conformity (DoC) 2023年 11月 6日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TPSM64406EVM — TPSM64406 評估模組

TPSM64406 評估模組 (EVM) 展示在多相位單輸出配置中具有整合式功率 MOSFET 與電感器的多 TPSM64406 降壓 DC/DC 模組的功能和性能。EVM 提供可載入高達 12A 的單一輸出。輸出電壓可個別編程至固定 3.3V 和 5V,也可使用外部反饋電阻器及跨接器進行調整。

TPSM64406EVM-4PH 的設計可在單一印刷電路板設計上展示兩個堆疊裝置的完整功能。

使用指南: PDF | HTML
模擬型號

TPSM64406 PSpice Transient Model

SLVME32.ZIP (1220 KB) - PSpice Model
計算工具

TPSM6440X-DESIGN-CALC TPSM6440X Design Calculator

TPSM6440X power module quickstart design tool
支援產品和硬體

支援產品和硬體

產品
電源模組 (整合式電感器)
TPSM64404 0.8V 至 16V 輸出、雙 2A 高密度電源模組 TPSM64406 高密度、36V、0.8V 至 16V 輸出、雙 3A 輸出功率模組 TPSM64406E 36V 輸入、0.8V 至 16V 輸出、雙 3A 輸出電源模組
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
封裝 針腳 CAD 符號、佔位空間與 3D 模型
QFN-FCMOD (RCH) 28 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片