Startseite Schnittstelle USB-ICs USB-Redriver & -Multiplexer

TS3USB221

AKTIV

Schneller 1:2-Multiplexer/Demultiplexer-Switch mit Freigabesignal für USB 2.0 (480 Mbit/s)

Produktdetails

Type Passive mux Function USB 2.0 USB speed (MBits) 480 Number of channels 2 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 3000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Configuration 2:1 SPDT Features Logic Controlled (Output Enabled), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 30 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 1100
Type Passive mux Function USB 2.0 USB speed (MBits) 480 Number of channels 2 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 3000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Configuration 2:1 SPDT Features Logic Controlled (Output Enabled), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 30 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 1100
UQFN (RSE) 10 3 mm² 2 x 1.5 VSON (DRC) 10 9 mm² 3 x 3
  • VCC Operation from 2.3 V and 3.6 V
  • VI/O Accepts Signals up to 5.5 V
  • 1.8-V Compatible Control-Pin Inputs
  • Low-Power Mode When OE Is Disabled (1 µA)
  • rON = 6 Ω Maximum
  • ΔrON = 0.2 Ω Typical
  • Cio(on) = 6 pF Maximum
  • Low Power Consumption (30 µA Maximum)
  • ESD > 2000-V Human-Body Model (HBM)
  • High Bandwidth (1.1 GHz Typical)
  • VCC Operation from 2.3 V and 3.6 V
  • VI/O Accepts Signals up to 5.5 V
  • 1.8-V Compatible Control-Pin Inputs
  • Low-Power Mode When OE Is Disabled (1 µA)
  • rON = 6 Ω Maximum
  • ΔrON = 0.2 Ω Typical
  • Cio(on) = 6 pF Maximum
  • Low Power Consumption (30 µA Maximum)
  • ESD > 2000-V Human-Body Model (HBM)
  • High Bandwidth (1.1 GHz Typical)

The TS3USB221 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1.1 GHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB221 is designed for low bit-to-bit skew and high channel to channel noise isolation. The TS3USB221 is also compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB221 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1.1 GHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB221 is designed for low bit-to-bit skew and high channel to channel noise isolation. The TS3USB221 is also compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

Herunterladen Video mit Transkript ansehen Video

Ähnliche Produkte, die für Sie interessant sein könnten

Gleiche Funktionalität, gleiche Pinbelegung wie verglichener Baustein
TS3USB3000 AKTIV DPDT USB 2.0 Highspeed- und mobiler hochauflösender Verbindungs-Schalter (MHL) (6,1 GHz) higher bandwidth device and pin to pin with TS3USB221RSE

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 4
Typ Titel Datum
* Data sheet TS3USB221 High-speed USB 2.0 (480-Mbps) 1:2 multiplexer – demultiplexer switch with single enable datasheet (Rev. J) PDF | HTML 14 Jan 2019
Application note Passive Mux Selection Based On Bandwidth > Ron 11 Sep 2019
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 14 Jun 2018
User guide TS3USB221/A/E Evaluation Module User’s Guide (Rev. A) 26 Okt 2009

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

DLPLCR4500EVM — DLP® LightCrafter™ 4500

The DLP® LightCrafter™ 4500 development module provides a flexible light steering solution with high brightness and resolution for industrial, medical and scientific applications. DLP LightCrafter 4500 features the 0.45 WXGA chipset and offers a compelling combination of resolution, (...)

Benutzerhandbuch: PDF
Evaluierungsplatine

TS3USB221AEVM — Evaluierungsmodul für TS3USB221A

The TS3USB221AEVM is an evaluation module (EVM) for the TS3USB221A high-speed USB 2.0 (480-Mbps) 1:2 multiplexer/demultiplexer switch. The TS3USB221AEVM lets signal pass with minimum edge and phase distortion, integrates ESD protection cells on all pins, and also multiplexes (...)

Benutzerhandbuch: PDF
Evaluierungsplatine

TS3USB221EEVM — TS3USB221E-Evaluierungsmodul

The TS3USB221EEVM is an evaluation module for the Texas Instruments high-speed USB 2.0 (480-Mbps) 1:2 multiplexer/demultiplexer switch. The USB221EEVM allows signals to pass with minimum edge and phase distortion, integrates IEC-level ESD protection cells on all pins, and also multiplexes (...)

Benutzerhandbuch: PDF
Evaluierungsplatine

TS3USB221EVM — TS3USB221-Evaluierungsmodul

The TS3USB221EVM is an evaluation module for the Texas Instruments high-speed USB 2.0 (480-Mbps) 1:2 multiplexer/demultiplexer switch. The USB221EVM allows signals to pass with minimum edge and phase distortion and also multiplexes differential signals from a common USB input to one of two (...)

Benutzerhandbuch: PDF
Simulationsmodell

HSPICE Model for TS3USB221

SCDJ030.ZIP (98 KB) - HSpice Model
Simulationsmodell

TS3USB221 IBIS Model (Rev. A)

SCDM098A.ZIP (42 KB) - IBIS Model
Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Simulationstool

TINA-TI — SPICE-basiertes analoges Simulationsprogramm

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Benutzerhandbuch: PDF
Referenzdesigns

TIDA-00538 — 1 S, 5 A, Schnellladegerät mit MaxCharge™-Technologie für hohe VIN und einstellbaren USB OTG-A

The bq25892 is a highly-integrated switch-mode battery charge management and system power path management device for single cell Li-Ion and Li-polymer battery in a wide range of smartphone and other portable devices with USB or high voltage adaptors. Its low impedance power path optimizes (...)
Test report: PDF
Schaltplan: PDF
Referenzdesigns

TIDA-01582 — Referenzdesign für Schnellladung mit geschaltetem Kondensator für programmierbare USB-Stromversorgun

The goal of this reference design is to show the total system performance when using the switched-cap fast charge topology in a smart phone application. The system includes using a smart wall adapter that supports USB Power Delivery (PD) Programmable Power Supply (PPS) specifications to reduce (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

DLP4500-C350REF — Referenzdesign für hochauflösende, portable Lichtsteuerung mit DLP-Technologie

This reference design, featuring the DLP® 0.45” WXGA chipset and implemented in the DLP® LightCrafter™ 4500 evaluation module (EVM), enables flexible control of high resolution, accurate patterns for industrial, medical, and scientific applications. With a free USB-based GUI and (...)
Test report: PDF
Schaltplan: PDF
Referenzdesigns

TIDA-00254 — Präzise Point-Cloud-Generation für 3D-Bildverarbeitungsanwendungen mit DLP®-Technologie

The 3D Machine Vision reference design employs Texas Instruments DLP® Advanced Light Control Software Development Kit (SDK) for LightCrafter™ series controllers, which allows developers to easily construct 3D point clouds by integrating TI’s digital micromirror device (DMD) (...)
Test report: PDF
Schaltplan: PDF
Referenzdesigns

PMP4496 — Referenzdesign für USB-C-DRP-Ladegerät mit Schnellladeeingang

PMP4496 is a power bank reference design with a single USB type C dual role port (DRP). It can perform as a SINK or SOURCE. Role is automatically determined according to the external device attached. Fast charger input is also supported to save more charging time.
Test report: PDF
Schaltplan: PDF
Referenzdesigns

TIDA-00590 — Referenzdesign für Dual-Batterielader-IC (verbunden über Kaskodenkonfiguration)

Higher capacity 1S batteries in the latest smartphones and tablets need higher charge currents to charge faster.  With 12-V power sources, two 5-A battery charger ICs connected in cascode, parallel configuration can provide more than 5-A charging current.  In addition, the heat from the (...)
Schaltplan: PDF
Referenzdesigns

TIDA-00589 — I2C-gesteuertes Einzelzellen-5A-Schnellladegerät mit MaxCharge und 3,1A-Boost-Betrieb für Power Bank

TIDA-00589 demonstrates the fully-integrated single-cell 5A charger bq25895 with 3.1A synchronous boost operation. bq25895 is a single-chip 1S power bank solution supporting high voltage adaptor to achieve up to 5A fast charging. The high efficiency of the synchronous boost maximizes the power (...)
Test report: PDF
Schaltplan: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
UQFN (RSE) 10 Ultra Librarian
VSON (DRC) 10 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos