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CD4041UB-MIL

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Búfer verdadero/complemento CMOS cuádruple

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CD4041UB-MIL

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Detalles del producto

Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 10 Rating Military Operating temperature range (°C) -55 to 125
Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Standard speed (tpd > 50ns) Data rate (max) (Mbps) 10 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67
  • Balanced sink and source current; approximately 4 times standard "B" drive
  • Equalized delay to true and complement outputs
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range; 100nA at 18 V and 25°C
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13A, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Applications:
    • High current source/sink driver
    • CMOS-to-DTL/TTL Converter Buffer
    • Display driver
    • MOS clock driver
    • Resistor network driver (Ladder or weighted R)
    • Buffer
    • Transmission line driver
  • Balanced sink and source current; approximately 4 times standard "B" drive
  • Equalized delay to true and complement outputs
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 µA at 18 V over full package temperature range; 100nA at 18 V and 25°C
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13A, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Applications:
    • High current source/sink driver
    • CMOS-to-DTL/TTL Converter Buffer
    • Display driver
    • MOS clock driver
    • Resistor network driver (Ladder or weighted R)
    • Buffer
    • Transmission line driver

CD4041UB types are quad true/complement buffers consisting of n- and p-channel units having low channel resistance and high current (sourcing and sinking) capability. The CD4041UB is intended for use as a buffer, line-driver, or CMOS-to-TTL driver. It can be used as an ultra-low power resistor-network driver for A/D and D/A conversion, as a transmission-line driver, and in other applications where high noise immunity and low power dissipation are primary design requirements.

The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4041UB types are quad true/complement buffers consisting of n- and p-channel units having low channel resistance and high current (sourcing and sinking) capability. The CD4041UB is intended for use as a buffer, line-driver, or CMOS-to-TTL driver. It can be used as an ultra-low power resistor-network driver for A/D and D/A conversion, as a transmission-line driver, and in other applications where high noise immunity and low power dissipation are primary design requirements.

The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes).
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* Data sheet CD4041UB TYPES datasheet (Rev. C) 21 ago 2003

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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