Inductive sensing technology enables touch button design for human machine interface (HMI) on a wide variety of materials such as metal, glass, plastic, and wood, by measuring small deflections of conductive targets. The sensor for an inductive touch system is a coil that can be implemented on a small PCB located behind the panel and protected from the environment. Inductive sensing solution is insensitive to humidity or non-conductive contaminants such as oil and dirt. It is able to automatically correct for any deformation in the conductive targets.
The LDC2112/LDC2114 is a multi-channel low-noise inductance to digital converter with integrated algorithms to implement inductive touch applications. The device employs an innovative LC resonator that offers high rejection of noise and interference. The LDC2112/LDC2114 can reliably detect material deflections of less than 200 nm.
The LDC2112/LDC2114 includes an ultra-low power mode intended for power on/off buttons in battery powered applications.
The LDC2112/LDC2114 is available in a 16-pin DSBGA or TSSOP package. The 0.4 mm pitch DSBGA package has a very small 1.6 × 1.6 mm nominal body size with a maximum height of 0.4 mm. The 0.65 mm pitch TSSOP package has a 5.0 × 4.4 mm nominal body size with a maximum height of 1.2 mm.
Inductive sensing technology enables touch button design for human machine interface (HMI) on a wide variety of materials such as metal, glass, plastic, and wood, by measuring small deflections of conductive targets. The sensor for an inductive touch system is a coil that can be implemented on a small PCB located behind the panel and protected from the environment. Inductive sensing solution is insensitive to humidity or non-conductive contaminants such as oil and dirt. It is able to automatically correct for any deformation in the conductive targets.
The LDC2112/LDC2114 is a multi-channel low-noise inductance to digital converter with integrated algorithms to implement inductive touch applications. The device employs an innovative LC resonator that offers high rejection of noise and interference. The LDC2112/LDC2114 can reliably detect material deflections of less than 200 nm.
The LDC2112/LDC2114 includes an ultra-low power mode intended for power on/off buttons in battery powered applications.
The LDC2112/LDC2114 is available in a 16-pin DSBGA or TSSOP package. The 0.4 mm pitch DSBGA package has a very small 1.6 × 1.6 mm nominal body size with a maximum height of 0.4 mm. The 0.65 mm pitch TSSOP package has a 5.0 × 4.4 mm nominal body size with a maximum height of 1.2 mm.