Inicio Amplificadores Amplificadores de función especial Resistencias emparejadas de película delgada

Divisor automotriz de resistencia emparejada, de película fina, 1400 V, con entrada fija de

Detalles del producto

Rating Automotive Number of dividers 1 Divider ratio 500:1 Input resistance (Ω) 12500 Gain resistance (Ω) 25 Initial ratio tolerance (typ) (ppm) ±200 Initial ratio tolerance (max) (ppm) ±1000 TI functional safety category Functional Safety-Capable Operating temperature range (°C) -40 to 125
Rating Automotive Number of dividers 1 Divider ratio 500:1 Input resistance (Ω) 12500 Gain resistance (Ω) 25 Initial ratio tolerance (typ) (ppm) ±200 Initial ratio tolerance (max) (ppm) ±1000 TI functional safety category Functional Safety-Capable Operating temperature range (°C) -40 to 125
SOIC (DWV) 8 67.275 mm² 5.85 x 11.5
  • AEC-Q200 qualified for automotive applications:
    • Temperature grade 1: –40°C to +125°C
  • High voltage rating:
    • Survives 3+ HiPOT tests at 4000VDC (60s)
    • 1700VDC creepage and clearance support between HVIN and LVIN (IEC-61010 PD 2)
  • High dc precision with low shift and drift:
    • Initial ratio matching precision: ±0.1% (max)
    • Low drift: ±1ppm/°C (typ)

    • Accurate ±0.2% across aging and temperature
  • Low thermal noise (1kHz) thin-film resistors:
    • 30nV/√Hz (210:1 ratio)
    • 25nV/√Hz (310:1 ratio)
    • 22nV/√Hz (410:1 ratio)
    • 20nV/√Hz (500:1 ratio)
    • 18nV/√Hz (610:1 ratio)
    • 14nV/√Hz (1000:1 ratio)
  • AEC-Q200 qualified for automotive applications:
    • Temperature grade 1: –40°C to +125°C
  • High voltage rating:
    • Survives 3+ HiPOT tests at 4000VDC (60s)
    • 1700VDC creepage and clearance support between HVIN and LVIN (IEC-61010 PD 2)
  • High dc precision with low shift and drift:
    • Initial ratio matching precision: ±0.1% (max)
    • Low drift: ±1ppm/°C (typ)

    • Accurate ±0.2% across aging and temperature
  • Low thermal noise (1kHz) thin-film resistors:
    • 30nV/√Hz (210:1 ratio)
    • 25nV/√Hz (310:1 ratio)
    • 22nV/√Hz (410:1 ratio)
    • 20nV/√Hz (500:1 ratio)
    • 18nV/√Hz (610:1 ratio)
    • 14nV/√Hz (1000:1 ratio)

The RES60A-Q1 is a matched resistive divider, implemented in thin-film SiCr with Texas Instruments’ modern, high-performance, analog wafer process. A high quality SiO2 insulative layer encapsulates the resistors and enables usage at extremely high voltages, up to 1400VDC for sustained operation or 4000VDC for HiPOT testing (60s). The device has a nominal input resistance of RHV = 12.5MΩ, and is available in several nominal ratios to meet a wide array of system needs.

The RES60A-Q1 series features high ratio matching precision, with the measured ratio of each divider within ±0.1% (max) of the nominal. This precision is maintained over the specified temperature range and aging, with a cumulative drift of only ±0.2% (max). Therefore, the lifetime tolerance of an uncalibrated RES60A-Q1 remains within a ±0.3% (max) envelope.

The RES60A-Q1 is automotive qualified under AEC-Q200 temperature grade 1, with a specified temperature range from –40°C to +125°C. The device is offered in an 8-pin SOIC package, with nominal body size 7.5mm × 5.85mm, and features creepage and clearance distances of at least 8.5mm between the high-voltage and low-voltage pins.

The RES60A-Q1 is a matched resistive divider, implemented in thin-film SiCr with Texas Instruments’ modern, high-performance, analog wafer process. A high quality SiO2 insulative layer encapsulates the resistors and enables usage at extremely high voltages, up to 1400VDC for sustained operation or 4000VDC for HiPOT testing (60s). The device has a nominal input resistance of RHV = 12.5MΩ, and is available in several nominal ratios to meet a wide array of system needs.

The RES60A-Q1 series features high ratio matching precision, with the measured ratio of each divider within ±0.1% (max) of the nominal. This precision is maintained over the specified temperature range and aging, with a cumulative drift of only ±0.2% (max). Therefore, the lifetime tolerance of an uncalibrated RES60A-Q1 remains within a ±0.3% (max) envelope.

The RES60A-Q1 is automotive qualified under AEC-Q200 temperature grade 1, with a specified temperature range from –40°C to +125°C. The device is offered in an 8-pin SOIC package, with nominal body size 7.5mm × 5.85mm, and features creepage and clearance distances of at least 8.5mm between the high-voltage and low-voltage pins.

Descargar Ver vídeo con transcripción Video

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 4
Tipo Título Fecha
* Data sheet RES60A-Q1 Automotive, 1400VDC , Precision Resistive Divider datasheet PDF | HTML 10 sep 2024
Technical article How integrated resistor dividers improve EV battery system performance PDF | HTML 23 sep 2024
Certificate RES60EVM EU Declaration of Conformity (DoC) 10 sep 2024
EVM User's guide RES60 Evaluation Module User's Guide PDF | HTML 05 sep 2024

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

RES60EVM — Módulo de evaluación RES60A-Q1

El módulo de evaluación (EVM) RES60 está diseñado para ayudar a los usuarios a evaluar y probar fácilmente el funcionamiento y la funcionalidad del dispositivo RES60. El módulo de evaluación (EVM) está configurado como divisor de resistencia seguido de un búfer de amplificador operacional. Este (...)

Guía del usuario: PDF | HTML
Modelo de simulación

RES60A-Q1 PSpice Model

SLPM362.ZIP (27 KB) - PSpice Model
Modelo de simulación

RES60A-Q1 SPICE Model

SLPM365.ZIP (1 KB) - TISpice Model
Modelo de simulación

RES60A-Q1 TINA-TI Reference Design

SLPM364.TSC (14 KB) - TINA-TI Reference Design
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOIC (DWV) 8 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos