SN74LVC1G08

ACTIVO

Compuerta AND de 1 canal y 2 entradas de 1.65 V a 5.5 V y 32 mA de potencia de accionamiento

Detalles del producto

Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Number of channels 1 Inputs per channel 2 IOL (max) (mA) 32 IOH (max) (mA) -32 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Data rate (max) (Mbps) 100 Rating Catalog Operating temperature range (°C) -40 to 125
Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Number of channels 1 Inputs per channel 2 IOL (max) (mA) 32 IOH (max) (mA) -32 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Data rate (max) (Mbps) 100 Rating Catalog Operating temperature range (°C) -40 to 125
DSBGA (YZP) 5 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 5 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DPW) 5 0.64 mm² 0.8 x 0.8 X2SON (DSF) 6 1 mm² 1 x 1
  • Available in the Ultra Small 0.64-mm2
    Package (DPW) With 0.5-mm Pitch
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Provides Down Translation to VCC
  • Max tpd of 3.6 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Available in the Ultra Small 0.64-mm2
    Package (DPW) With 0.5-mm Pitch
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Provides Down Translation to VCC
  • Max tpd of 3.6 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

This single 2-input positive-AND gate is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G08 device performs the Boolean function or in positive logic.

The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating range.

The SN74LVC1G08 is available in a variety of packages, including the ultra-small DPW package with a body size of 0.8 mm × 0.8 mm.

This single 2-input positive-AND gate is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G08 device performs the Boolean function or in positive logic.

The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating range.

The SN74LVC1G08 is available in a variety of packages, including the ultra-small DPW package with a body size of 0.8 mm × 0.8 mm.

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SN74LVC1G08-Q1 ACTIVO Compuerta AND automotriz de 1 canal y 2 entradas de 1.65 V a 5.5 V y 32 mA de potencia de accionamie Voltage range 1.65V to 5.5V, average propagation delay 5.5ns, average drive strength 24mA
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SN74AUP1G08 ACTIVO Compuerta AND de 1 canal y 2 entradas de 0.8 V a 3.6 V y baja potencia (<1 uA) Smaller voltage range (0.8V to 3.6V), longer average propagation delay (8ns), lower average drive strength (4mA)

Documentación técnica

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Tipo Título Fecha
* Data sheet SN74LVC1G08 Single 2-Input Positive-AND Gate datasheet (Rev. Z) 26 mar 2019
Product overview Generate an Enable Signal that can be Toggled PDF | HTML 14 jun 2023
Application brief Optimizing Optical Network Terminal Units With Logic PDF | HTML 05 abr 2023
Application brief Optimizing Industrial Robot CPU Boards with Logic and Voltage Translation PDF | HTML 12 dic 2022
Application brief Optimizing WLAN and WiFi Access Point Systems With Logic and Voltage Translation PDF | HTML 03 nov 2022
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Application note Applications of Logic and Translation in IP Cameras (Rev. A) PDF | HTML 29 mar 2021
Application note Optimizing HVAC Gateway Designs W/ Common Logic & Translation Voltage Use Cases (Rev. B) PDF | HTML 29 mar 2021
Application brief Simplifying Solid-State Relay Designs With Logic PDF | HTML 08 ene 2021
Application brief Enable and Disable Digital Signals PDF | HTML 04 nov 2020
Application brief Combine Power Good Signals PDF | HTML 02 oct 2020
Selection guide Little Logic Guide 2018 (Rev. G) 06 jul 2018
Application note Designing and Manufacturing with TI's X2SON Packages 23 ago 2017
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note How to Select Little Logic (Rev. A) 26 jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 dic 2002
Application note Texas Instruments Little Logic Application Report 01 nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 may 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 dic 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note LVC Characterization Information 01 dic 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

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Módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo que tenga un encapsulado DCK, DCT, DCU, DRL o DBV en un recuento de 5 a 8 pines.
Guía del usuario: PDF
Kit de desarrollo

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Guía del usuario: PDF
Modelo de simulación

SN74LVC1G08 Behavioral SPICE Model

SCEM642.ZIP (7 KB) - PSpice Model
Modelo de simulación

SN74LVC1G08 IBIS Model (Rev. A)

SCEM167A.ZIP (42 KB) - IBIS Model

Muchos diseños de referencia de TI incluyen SN74LVC1G08

Utilice nuestra herramienta de selección de diseños de referencia para revisar e identificar los diseños que mejor se adaptan a su aplicación y parámetros.

Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YZP) 5 Ultra Librarian
SOT-23 (DBV) 5 Ultra Librarian
SOT-5X3 (DRL) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian
USON (DRY) 6 Ultra Librarian
X2SON (DPW) 5 Ultra Librarian
X2SON (DSF) 6 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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