The TLV752 is a dual, adjustable, 1-A low-dropout (LDO) regulator. This device is available in a small, 10-pin, 2-mm × 2-mm WSON package and consumes 25-µA quiescent current while providing fast line and load transient response. The TLV752 features a low dropout of 225 mV that can help improve the overall power efficiency.
The TLV752 wide input-and-output voltage ranges, when combined with its output current capability in a small printed circuit board (PCB) footprint help support a wide variety of applications from sensor supplies, to auxiliary rails, and modern microcontrollers with lower core voltages.
The TLV752 is stable with small ceramic output capacitors, allowing for a small overall solution size. A precision band-gap and error amplifier provides high accuracy of 1.5% (max) over temperature. This device includes integrated thermal shutdown, current limit, active output-discharge, and undervoltage lockout (UVLO) features. The TLV752 has an internal fold-back current-limit to reduce thermal dissipation during short-circuit events.
The TLV752 is a dual, adjustable, 1-A low-dropout (LDO) regulator. This device is available in a small, 10-pin, 2-mm × 2-mm WSON package and consumes 25-µA quiescent current while providing fast line and load transient response. The TLV752 features a low dropout of 225 mV that can help improve the overall power efficiency.
The TLV752 wide input-and-output voltage ranges, when combined with its output current capability in a small printed circuit board (PCB) footprint help support a wide variety of applications from sensor supplies, to auxiliary rails, and modern microcontrollers with lower core voltages.
The TLV752 is stable with small ceramic output capacitors, allowing for a small overall solution size. A precision band-gap and error amplifier provides high accuracy of 1.5% (max) over temperature. This device includes integrated thermal shutdown, current limit, active output-discharge, and undervoltage lockout (UVLO) features. The TLV752 has an internal fold-back current-limit to reduce thermal dissipation during short-circuit events.