TMP103

ACTIVO

Sensor de temperatura digital de ±2 °C con I2C/SMBus, con capacidad para 1.4 V en WCSP

Detalles del producto

Local sensor accuracy (max) 2 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 1.4 Interface type I2C, SMBus Supply voltage (max) (V) 3.6 Features One-shot conversion Supply current (max) (µA) 3 Temp resolution (max) (bps) 8 Remote channels (#) 0 Addresses 8 Rating Catalog
Local sensor accuracy (max) 2 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 1.4 Interface type I2C, SMBus Supply voltage (max) (V) 3.6 Features One-shot conversion Supply current (max) (µA) 3 Temp resolution (max) (bps) 8 Remote channels (#) 0 Addresses 8 Rating Catalog
DSBGA (YFF) 4 1 mm² 1 x 1
  • Multiple Device Access (MDA):
    • Global Read/Write Operations
  • I2C™ and SMBus™-Compatible Interface
  • Resolution: 8 Bits
  • Accuracy: ±1°C Typical (–10°C to 100°C)
  • Low Quiescent Current:
    • 3-µA Active IQ at 0.25 Hz
    • 1-µA Shutdown
  • Supply Range: 1.4 V to 3.6 V
  • Digital Output
  • 4-Ball WCSP (DSBGA) Package
  • Multiple Device Access (MDA):
    • Global Read/Write Operations
  • I2C™ and SMBus™-Compatible Interface
  • Resolution: 8 Bits
  • Accuracy: ±1°C Typical (–10°C to 100°C)
  • Low Quiescent Current:
    • 3-µA Active IQ at 0.25 Hz
    • 1-µA Shutdown
  • Supply Range: 1.4 V to 3.6 V
  • Digital Output
  • 4-Ball WCSP (DSBGA) Package

The TMP103 is a digital output temperature sensor in a four-ball wafer chip-scale package (WCSP). The TMP103 is capable of reading temperatures to a resolution of 1°C.

The TMP103 features a two-wire interface that is compatible with both I2C and SMBus interfaces. In addition, the interface supports multiple device access (MDA) commands that allow the master to communicate with multiple devices on the bus simultaneously, eliminating the need to send individual commands to each TMP103 on the bus.

Up to eight TMP103s can be tied together in parallel and easily read by the host. The TMP103 is especially suitable for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored.

The TMP103 is specified for operation over a temperature range of –40°C to 125°C.

The TMP103 is a digital output temperature sensor in a four-ball wafer chip-scale package (WCSP). The TMP103 is capable of reading temperatures to a resolution of 1°C.

The TMP103 features a two-wire interface that is compatible with both I2C and SMBus interfaces. In addition, the interface supports multiple device access (MDA) commands that allow the master to communicate with multiple devices on the bus simultaneously, eliminating the need to send individual commands to each TMP103 on the bus.

Up to eight TMP103s can be tied together in parallel and easily read by the host. The TMP103 is especially suitable for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored.

The TMP103 is specified for operation over a temperature range of –40°C to 125°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TMP103 Low-Power, Digital Temperature Sensor With Two-Wire Interface in WCSP datasheet (Rev. D) PDF | HTML 21 dic 2018
Application note How to Read and Interpret Digital Temperature Sensor Output Data PDF | HTML 12 abr 2024
Application brief Improving System Reliability in Auto and Ind. Cameras w/ AccurateTemp. Sensing PDF | HTML 03 ene 2022
Technical article Interface to sensors in seconds with ASC Studio PDF | HTML 12 nov 2020
Application note Temperature sensors: PCB guidelines for surface mount devices (Rev. A) 18 ene 2019
EVM User's guide TMP103EVM User Guide (Rev. A) 18 abr 2018
Technical article Real-time temperature sensing with dual-mode connectivity PDF | HTML 03 nov 2016
User guide SM-USB-DIG Platform User Guide 14 ene 2011

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TMP103EVM — Módulo de evaluación TMP103

The TMP103EVM is a simple EVM designed to allow full evaluation of the TMP103 device. The EVM has eight total TMP103's installed. Each device is tied together but has a separate hardware address. This allows the user to take advantage of the I2C general call described in the TMP103 product data (...)

Guía del usuario: PDF
Controlador o biblioteca

TMP103SW-LINUX — Controlador Linux para TMP103

The Linux driver support the TMP103 Temperature Sensor. The Linux driver supports communication through the I2C bus and interfaces with the Hardware Monitoring sub-system.
Linux Mainline Status

Available in Linux Main line: Yes
Available through git.ti.com: N/A

Supported Devices:
  • tmp103
Linux Source (...)
IDE, configuración, compilador o depurador

ASC-STUDIO-TMP103 ASC studio for configuring all aspects of the TMP103 temperature sensor

SysConfig can be used to help simplify configuration challenges and accelerate software development with the TMP103 temperature sensor.
Productos y hardware compatibles

Productos y hardware compatibles

Productos
Sensores de temperatura digitales
TMP103 Sensor de temperatura digital de ±2 °C con I2C/SMBus, con capacidad para 1.4 V en WCSP
Soporte de software

SBOC392 TMP103EVM Source Code

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Sensores de temperatura digitales
TMP103 Sensor de temperatura digital de ±2 °C con I2C/SMBus, con capacidad para 1.4 V en WCSP
Desarrollo de hardware
Placa de evaluación
TMP103EVM Módulo de evaluación TMP103
Soporte de software

SBOC393 TMP103EVM Software

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Sensores de temperatura digitales
TMP103 Sensor de temperatura digital de ±2 °C con I2C/SMBus, con capacidad para 1.4 V en WCSP
Desarrollo de hardware
Placa de evaluación
TMP103EVM Módulo de evaluación TMP103
Modelo de simulación

TMP103 IBIS Model

SBOM450.ZIP (30 KB) - IBIS Model
Esquema

TMP103EVM Schematic

SBOR013.PDF (24 KB)
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YFF) 4 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

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