TMP9R00-SP
- QMLV Qualified: 5962R2021401VXC
- Radiation-Hardness-Assured (RHA) up to Total Ionizing Dose (TID) 100 krad(Si) at low dose rate (LDR) of 10 mrad/s
- Single Event Latchup (SEL) Immune to 76 MeV·cm2 /mg at 125°C
- Thermally Enhanced 16-Lead Ceramic HKT Package
- 8-Channel Remote Diode Temperature Sensor Accuracy: ±1.5°C
- Local Temperature Sensor Accuracy: ±1.5°C
- Temperature Resolution: 0.0625°C
- Logic Voltage Range: 1.7 V to 3.6 V
- Supply Range: 1.7 V to 2.0 V
- 67 µA Operating Current (1 SPS, All Channels Active)
- 0.3 µA Shutdown Current
- Remote Diode: Series Resistance Cancellation, η-Factor Correction, Offset Correction, and Diode Fault Detection
- Register Lock Function Secures Key Registers
- I2C or SMBus™ Compatible Two-Wire Interface With Pin-Programmable Address
The TMP9R00-SP device is a radiation-hardened, multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I2C compatible interface. Up to eight remote and one local temperature zones can be monitored simultaneously, aggregating the temperature measurements in a system reducing design complexity. Typical use cases are monitoring temperature of different high power devices, such as MCUs, GPUs, ADCs, DACs and FPGAs. Advanced features such as series resistance cancellation, programmable ideality factor, temperature offset correction, and temperature limits are included to provide a robust thermal monitoring solution.
Each remote channel and the local channel have two independently programmable thresholds that trigger when the corresponding temperature exceeds the limit. A programmable hysteresis setting is available to avoid toggling around the threshold.
The TMP9R00-SP device provides high accuracy (±1.5°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 2.0 V), common two-wire interfaces (1.7 V to 3.6 V), and an operating temperature range from –55°C to 125°C and a remote junction temperature range from –55°C to 150°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TMP9R00-SP 9-Channel (8-Remote and 1-Local), High-Accuracy Temperature Sensor datasheet (Rev. A) | PDF | HTML | 2022/08/04 |
* | Radiation & reliability report | TMP9R00-SP Single-Event Effects (SEE) Radiation Test Report | PDF | HTML | 2023/08/14 |
* | SMD | TMP9R00-SP SMD 5962-20214 | 2023/07/10 | |
* | Radiation & reliability report | TMP9R00-SP Total Ionizing Dose (TID) | PDF | HTML | 2022/08/15 |
Application brief | DLA Approved Optimizations for QML Products (Rev. B) | PDF | HTML | 2024/05/17 | |
Selection guide | TI Space Products (Rev. J) | 2024/02/12 | ||
More literature | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) | 2023/08/31 | ||
Application note | Remote Temperature Transistor Sensor Selection Guide | PDF | HTML | 2021/03/24 | |
Application note | Measuring Die Temperature with Remote Diode Sensing in Space | 2018/12/10 |
설계 및 개발
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TMP9R01EVM — TMP9R01 evaluation module
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CFP (HKT) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치