CSD95378BQ5M

現行

具 TAO 偏移的 60A 同步降壓 NexFET™ 智慧功率級

產品詳細資料

VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -55 to 150
VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -55 to 150
LSON-CLIP (DQP) 12 30 mm² 6 x 5
  • 60-A Continuous Operating Current Capability
  • 93.4% System Efficiency at 30 A
  • Low-Power Loss of 2.8 W at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output (400 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density SON 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 60-A Continuous Operating Current Capability
  • 93.4% System Efficiency at 30 A
  • Low-Power Loss of 2.8 W at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output (400 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density SON 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95378BQ5M NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high speed switching capability in a small
5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95378BQ5M NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high speed switching capability in a small
5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

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類型 標題 日期
* Data sheet CSD95378BQ5M Synchronous Buck NexFET Smart Power Stage datasheet (Rev. B) PDF | HTML 2017年 7月 21日

設計與開發

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參考設計

PMP11184 — 適用於 ASIC 處理器且具有 PMBus 的高效率、功率密度 1V/120A/30A/30A (4+1+1) 參考設計

PMP11184 is a chipset solution for high current ASIC core rail regulation. It utilizes TPS53647 4-phase controller for 120A high current rail, which employs  DCAP+ control for fast transient response and TI's proprietary AutoBalance for tight steady and dynamic phase-to-phase current balance. (...)
Test report: PDF
電路圖: PDF
參考設計

PMP9131 — 具有 PMBus 介面的高密度 160A (210A 峰值) 四相 DC-DC 降壓轉換器參考設計

Fixed frequency voltage mode control is used for CPU, Memory and ASIC applications where a predictable frequency and/or synchrnization to an external clock is needed.  Four high-current synchronous power stages provide the high currents and low losses needed for these applications. Multi-phase (...)
Test report: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
LSON-CLIP (DQP) 12 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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