產品規格表
PCA9306-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 2: –40°C to 105°C, TA
- HBM ESD classification level H2
- CDM ESD classification level C4B
- 2-Bit bidirectional translator for SDA and SCL lines in mixed-mode I2C applications
- Compatible with I2C and SMBus
- Less than 1.5-ns maximum propagation delay to accommodate standard-mode and fast-mode I2C devices and multiple controllers
- Allows voltage-level translation between
- 1.2-V VREF1 and 1.8-V, 2.5-V, 3.3-V, or 5-V VREF2
- 1.8-V VREF1 and 2.5-V, 3.3-V, or 5-V VREF2
- 2.5-V VREF1 and 3.3-V, or 5-V VREF2
- 3.3-V VREF1 and 5-V VREF2
- Provides bidirectional voltage translation with no direction pin
- Low 3.5-Ω ON-state connection between input and output ports provides less signal distortion
- Open-drain I2C I/O Ports (SCL1, SDA1, SCL2, and SDA2)
- 5-V tolerant I2C I/O ports to support mixed-mode signal operation
- High-impedance SCL1, SDA1, SCL2, and SDA2 pins for EN = low
- Lock-up-free operation for isolation when EN = Low
- Flow-through pinout for ease of printed-circuit board trace routing
- Latch-up performance exceeds 100 mA Per JESD 78, Class II
- ESD protection exceeds JESD 22
- 2000-V Human-body model (A114-A)
- 200-V Machine model (A115-A)
- 1000-V Charged-device model (C101)
This dual bidirectional I2C and SMBus voltage-level translator, with an enable (EN) input, is operational from 1.2-V to 3.3-V VREF1 and 1.8-V to 5.5-V VREF2.
The PCA9306-Q1 allows bidirectional voltage translations between 1.2 V and 5 V, without the use of a direction pin. The low ON-state resistance (ron) of the switch allows connections to be made with minimal propagation delay. When EN is high, the translator switch is ON, and the SCL1 and SDA1 I/O are connected to the SCL2 and SDA2 I/O, respectively, allowing bidirectional data flow between ports. When EN is low, the translator switch is off, and a high-impedance state exists between ports.
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開發板
PCA9306EVM — PCA9306 I2C 轉換器評估模組
This EVM can be used to evaluate the PCA9306 product in the DCU package. The I2C buses are easily accessed via SDA_1, SCL_1, SDA_2, and SCL_2 test points, and symmetrically laid out for optimal performance. All IC signals are available through test point connections.
使用指南: PDF
設計工具
I2C-DESIGNER — I2C 設計工具
Use the I2C Designer tool to quickly resolve conflicts in addressing, voltage level and frequency in I2C based designs. Enter master and slave inputs to automatically generate an I2C tree or easily build a custom solution. This tool will help designers save time and comply with the I2C standard (...)
模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
參考設計
TIDEP-01017 — 使用 Jacinto™ ADAS 處理器的串級成像雷達擷取參考設計
This reference design provides a processing foundation for a cascaded imaging radar system. Cascade radar devices can support front, long-range (LRR) beam-forming applications as well as corner- and side-cascade radar and sensor fusion systems. This reference design provides qualified developers (...)
參考設計
TIDA-00271 — 適用遠端攝影機和雷達模組的 ADAS 感測器互連參考設計基板
The ADAS Sensor Interconnect Board is intended for applications where remote sensors like cameras, LIDAR or radar modules need to be connected to a central processing ECU. The board supports up to 3 coaxial and 1 LVDS twisted pair data inputs as well as 3 FMC cable and 1 board to board connector as (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VSSOP (DCU) | 8 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。