TMUXHS4446
- Passive bidirectional USB-C Alternate Mode Mux to switch between USB and DisplayPort signals
- Supports USB 3.2 up to 10Gbps (Gen 2.0) and DisplayPort 2.1 up to 10Gbps per lane (UHBR10)
- Compatible for Source/Host and Sink/Device applications
- −3dB differential BW: 9.5GHz
- Dynamic characteristics:
- Insertion loss = −1.6dB at 5GHz
- Return loss = −18dB at 5GHz
- Supports common mode voltage (CMV) from 0V to 1.8V
- Adaptive CMV tracking
- 6V tolerant SBU pins to survive short-to-VBUS events
- Can be configured through GPIO pins or I2C
- Supports both 1.8V and 3.3V I2C
- Single supply voltage VCC: 3.3V
- Active power consumption: 340µA
- Low standby power consumption: 0.5µA (pin mode)
- Extended industrial temperature: −40°C to 105°C
- Available in 3mm × 6mm QFN package
The TMUXHS4446 is a high-speed bidirectional passive crosspoint switch or cossbar (Xbar). This device is used to switch between USB 3.2 Gen2 SuperSpeed and DisplayPort 1.4/2.1 (up to 10Gbps UHBR10) signals over a USB Type-C also known as USB-C interface. The device also provides switching for the low-speed SBU signals that are used for DisplayPort auxiliary channels. The TMUXHS4446 supports differential signaling with a common mode voltage (CMV) range of 0V to 1.8V and a differential amplitude from 0V to 1800mVpp. Adaptive CMV tracking enables the channel through the device to remain unchanged for the entire common-mode voltage range.
The dynamic characteristics of the TMUXHS4446 allows high-speed switching with minimum attenuation to the signal eye diagrams, and very little added jitter. The silicon design of the device is optimized for excellent frequency response at a higher frequency spectrum of the signals. The silicon signal traces and switch network of the TMUXHS4446 are matched for best intra-pair skew performance.
The TMUXHS4446 has an extended industrial temperature range (−40°C to 105°C) designed for many rugged applications, including industrial and high reliability use cases.
技術文件
設計與開發
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TMUXHS4446EVM — TMUXHS4446 評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RET) | 40 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。