TPS65983B
- This device is certified by the USB-IF for PD3.0
- PD3.0 silicon is required for certification of new USB PD designs
- Article on PD2.0 vs PD3.0
- USB3 & Thunderbolt 3 (TBT3) USB PD controller
- The TPS65983 B only supports TBT3 device designs following an Intel reference design document number 569174
- Port data multiplexer
- USB 2.0 HS data and low speed endpoint
- Sideband-use data for alternate modes
- Support for DisplayPort alternate mode and Thunderbolt alternate mode
- For a more extensive selection guide and getting started information, please refer to www.ti.com/usb-c and E2E guide
- Integrated fully managed power paths:
- Integrated 5-V, 3-A, 50-mΩ sourcing switch
- Integrated 5-V to 20-V, 3-A, 95-mΩ bi-directional load switch
- Gate control and current sense for external 5-V to 20-V, 5-A bidirectional switch (back-to back NFETs)
- Integrated robust power path protection
- Integrated reverse current protection, undervoltage protection, overvoltage protection, and slew rate control the high-voltage bi-directional power path
- Integrated undervoltage and overvoltage protection and current limiting for inrush current protection for the 5-V/3-A source power path
- USB Type-C Power Delivery (PD) controller
- 8 configurable GPIOs
- BC1.2 charging support
- USB PD 2.0 certified
- USB Type-C specification certified
- Cable attach and orientation detection
- Integrated VCONN switch
- Physical layer and policy engine
- 3.3-V LDO output for dead battery support
- Power supply from 3.3 V or VBUS source
- 1 I2C primary port
- 1 I2C secondary port
The TPS65983 B is a highly integrated stand-alone USB Type-C and Power Delivery (PD) controller optimized for notebook applications. The TPS65983 B integrates fully managed power paths with robust protection for a complete USB-C PD solution. The TPS65983 B includes a high speed multiplexer which is dependent the USB Type-C cable orientation that the CC pins provide. The multiplexer passes through side-band use data for alternate modes. The TPS65983 B has a BGA MicroStar Junior package with 0.5-mm Pitch and through-Hole via compatible for all pins.
The mixed-signal front end on the CC pins advertises default (500 mA), 1.5 A or 3 A for Type-C power sources, detects a plug event and determines the USB Type-C cable orientation, and autonomously negotiates USB PD contracts by adhering to the specified bi-phase marked coding (BMC) and physical layer (PHY) protocol.
The port power switch provides up to 3 A downstream at 5 V for legacy and Type-C USB power. An additional bidirectional switch path provides USB PD power up to 3 A at a maximum of 20 V as either a source (host), sink (device), or source-sink.
The TPS65983 B is also an Upstream-Facing Port (UFP), Downstream-Facing Port (DFP), or Dual-Role Port for data. The port data multiplexer passes data to or from the top or bottom D+/D– signal pair at the port for USB 2.0 HS and has a USB 2.0 Low Speed Endpoint. Additionally, the Sideband-Use (SBU) signal pair is used for auxiliary or Alternate Modes of communication (DisplayPort or Thunderbolt, for example).
The power management circuitry uses a 3.3 V inside the system and also uses VBUS to start up and negotiate power for a dead-battery or no-battery condition.
更多資訊
TPS65983B 專為 Thunderbolt 3 裝置而設計。要了解其他所有設計考量,請使用 TPS65988DH。
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPS65983B USB Type-C® and USB PD Controller, Power Switch, and High Speed Multiplexer For Thunderbolt 3 datasheet (Rev. C) | PDF | HTML | 2021年 8月 6日 |
White paper | A Primer on USB Type-C and Power Delivery Applications and Requirements (Rev. B) | PDF | HTML | 2022年 3月 25日 | |
Technical article | USB PD 3.0 fast role swap switching considerations | PDF | HTML | 2016年 10月 25日 | |
Technical article | Avoid these challenges when implementing USB Type-C™ protection | PDF | HTML | 2016年 10月 24日 | |
White paper | Circuit protection for your next USB Type-C design white paper | 2016年 10月 12日 | ||
White paper | USB Type-C™ represents breakthrough connectivity | 2015年 12月 4日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
NFBGA (ZBH) | 96 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
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