TS3USB3200
- VCC Range: 2.7 V to 4.3 V
- Mobile High-Definition Link (MHL) or Mobility
Display Port (MyDP) Switch- Bandwidth (–3 dB): 5.5 GHz
- Ron (Typical): 5.7 Ω
- Con (Typical): 2.5 pF
- USB Switch
- Bandwidth (–3 dB): 5.5 GHz
- Ron (Typical): 4.6 Ω
- Con (Typical): 2.5 pF
- Current Consumption: 40 µA Typical
- Special Features
- Flexible Power Control: Device Can be
Powered by VBUS Without VCC or by VCC Alone - IOFF Protection Prevents Current Leakage in
Powered-Down State (VCC and VBUS= 0 V) - 1.8-V Compatible Control Inputs (SEL1, SEL2,
and PSEL) - Overvoltage Tolerance (OVT) on All I/O Pins
up to 5.5 V Without External Components
- Flexible Power Control: Device Can be
- ESD Performance:
- 3.5-kV Human-Body Model (A114B, Class II)
- 1-kV Charged Device Model (C101)
- Package:
- 16-Pin UQFN Package (2.6 × 1.8 mm, 0.4-mm
Pitch)
- 16-Pin UQFN Package (2.6 × 1.8 mm, 0.4-mm
The TS3USB3200 is a differential single-pole, double throw (SPDT) multiplexer that includes a high-speed Mobile High-Definition Link (MHL) or Mobility Display Port (MyDP) switch and a USB 2.0 High-Speed (480 Mbps) switch in the same package. Additionally included is a single-pole, double throw (SPDT) USB/MHL or MyDP ID switch for easy information control. These configurations allow the system designer to use a common USB or Mico-USB connector for both MHL/MyDP video signals and USB data.
The TS3USB3200 has a VCC range of 2.7 V to 4.3 V and also has the option to be powered by VBUS without VCC. The device supports a overvoltage tolerance (OVT) feature which allows the I/O pins to withstand overvoltage conditions (up to 5.5 V). The power-off protection feature forces all I/O pins to be in high impedance mode when power is not present. This allows full isolation of the signals lines without excessive leakage current. The select pins of TS3USB3200 are compatible with 1.8-V control voltage, allowing them to be directly interfaced with the General Purpose I/O (GPIO) from a mobile processor.
The TS3USB3200 comes with a small 16-pin UQFN package (2.6 mm × 1.8 mm in size), which makes it a perfect candidate for mobile applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TS3USB3200 SPDT USB 2.0 High-Speed (480 Mbps) and Mobile High-Definition Link (MHL) or Mobility Display Port (MyDP) Switch With additional SPDT ID Select Switch and Flexible Power Control datasheet (Rev. B) | PDF | HTML | 2016年 7月 11日 |
Application note | Passive Mux Selection Based On Bandwidth (Rev. A) | PDF | HTML | 2024年 7月 31日 | |
Application note | High-Speed Layout Guidelines for Signal Conditioners and USB Hubs | 2018年 6月 14日 | ||
EVM User's guide | TS3USB3200 Evaluation Module User's Guide | 2013年 8月 29日 |
設計與開發
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TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
UQFN (RSV) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。