TSU6111A
- Switch Matrix
- USB
- UART Supports USB 2.0 High Speed
- Charger Detection
- USB BCDv1.1 Compliant
- VBUS Detection
- Data Contact Detection
- Primary and Secondary Detection
- Compatible Accessories
- USB Chargers (DCP, CDP)
- Factory Cable
- Additional Features
- I2C Interface with Host Processor
- Switches Controlled by Automatic Detection or Manual
Control - Interrupts Generated for Plug/Unplug
- Support Control Signals used In Manufacturing (JIG, BOOT)
- Max Voltage
- 28V VBUS rating
- ESD Performance Tested Per JESD 22
- 5000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 5000-V Human-Body Model
- IEC ESD Performance
- ±8kV Contact Discharge (IEC 61000-4-2) for
VBUS/DP_CON/DM_CON/ID_CON to GND
- ±8kV Contact Discharge (IEC 61000-4-2) for
- Surge Protection on VBUS/DP_CON/DM_CON
- USB Connector Pins Without External Component
The TSU6111A is a high performance differential autonomous SP2T switch with impedance detection. The switch supports the detection of various accessories that are attached through DP, DM, and ID. The charger detection satisfies USB charger specification v1.1 and VBUS_IN has a 28V tolerance to eliminate the need for external protection. Power for this device is supplied through VBAT of the system or throughVBUS_IN when attached to a charger.
The SP2T switch is controlled by the automatic detection logic or through manual configuration of the I2C. JIG and BOOT pins are used when a USB or UART JIG cable is used to test the device in the development and manufacturing. TSU6111A has open-drain JIG output (active low).
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | USB Port SP2T Switch Supports USB & UART datasheet (Rev. A) | 2012年 8月 6日 | |
Application note | High-Speed Interface Layout Guidelines (Rev. J) | PDF | HTML | 2023年 2月 24日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
UQFN (RSV) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。