TUSB542
- Provides USB 3.1 Gen-1 5Gbps Super Speed (SS) 2:1 mux for a USB Type-C™ port
- Supports USB Type-C cable and connector specifications
- Ultra low-power architecture:
- Active 100mA
- U2/U3 1.3mA
- No connection 300µA
- Selectable equalization up to 9dB, de-emphasis, and output swing up to 6dB
- Integrated termination
- RX-detect function
- Signal monitoring for power management
- No host or device side requirement – supports USB-C DFP, UFP or DRP port
- Single supply voltage 1.8V ±10%
- Industrial temperature range of –40 – 85°C
The TUSB542 is a dual channel USB 3.1 Gen1 (5Gbps), also known as USB-C, re-driver supporting systems with USB Type-C connectors. The device offers signal conditioning plus the ability to switch the USB SS signals for the USB Type-C flippable connector. The TUSB542 can be controlled through the SEL pin by an external Configuration Channel Logic Controller to properly mux the signals.
The TUSB542 incorporates receiver equalization and transmitter de-emphasis to maintain signal integrity on both transmit and receive data paths. The receiver equalization offers multiple gain settings to overcome channel degradation from insertion loss and inter-symbol interference. To compensate for downstream transmission line losses, the output driver supports de-emphasis configuration. Additionally, automatic LFPS de-emphasis control allows for full compliance.
The TUSB542 offers low power consumption on a 1.8V supply with its ultra-low power architecture. The re-driver supports low power modes, which further reduce the idle power consumption.
The USB Type-C redriver is available in a small ultra-thin package, which is an excellent choice for many portable applications.
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
TUSB542EVM — TUSB542 USB Type-C 5 Gbps 訊號調節器 2:1 多工器評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TIDA-00728 — 前連接埠 USB Type-C 延伸器參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
X2QFN (RWQ) | 18 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。