Startseite Energiemanagement Gate-Treiber Low-Side-Treiber
Startseite
Energiemanagement
Gate-Treiber
Low-Side-Treiber

UC2710

AKTIV

Einkanal-Gate-Treiber für 6 A/6 A mit 5-V-UVLO, geteilter Masse und 6-A-Spitzenausgangsstrom

Jetzt bestellen
Datenblatt

UC2710

AKTIV
Datenblatt Jetzt bestellen

Produktdetails

Number of channels 1 Power switch IGBT, MOSFET Peak output current (A) 6 Input supply voltage (min) (V) 4.7 Input supply voltage (max) (V) 18 Features Thermal shutdown Operating temperature range (°C) -40 to 85 Rise time (ns) 25 Fall time (ns) 20 Propagation delay time (µs) 0.035 Input threshold CMOS Channel input logic Inverting, Non-Inverting Input negative voltage (V) 0 Rating Catalog Undervoltage lockout (typ) (V) 4 Driver configuration Complementary
Number of channels 1 Power switch IGBT, MOSFET Peak output current (A) 6 Input supply voltage (min) (V) 4.7 Input supply voltage (max) (V) 18 Features Thermal shutdown Operating temperature range (°C) -40 to 85 Rise time (ns) 25 Fall time (ns) 20 Propagation delay time (µs) 0.035 Input threshold CMOS Channel input logic Inverting, Non-Inverting Input negative voltage (V) 0 Rating Catalog Undervoltage lockout (typ) (V) 4 Driver configuration Complementary
PDIP (P) 8 92.5083 mm² 9.81 x 9.43
  • Totem Pole Output with 6A Source/Sink Drive
  • 3ns Delay
  • 20ns Rise and Fall Time into 2.2nF
  • 8ns Rise and Fall Time into 30nF
  • 4.7V to 18V Operation
  • Inverting and Non-Inverting Outputs
  • Under-Voltage Lockout with Hysteresis
  • Thermal Shutdown Protection
  • MINIDIP and Power Packages
  • Totem Pole Output with 6A Source/Sink Drive
  • 3ns Delay
  • 20ns Rise and Fall Time into 2.2nF
  • 8ns Rise and Fall Time into 30nF
  • 4.7V to 18V Operation
  • Inverting and Non-Inverting Outputs
  • Under-Voltage Lockout with Hysteresis
  • Thermal Shutdown Protection
  • MINIDIP and Power Packages

The UC1710 family of FET drivers is made with a high-speed Schottky process to interface between low-level control functions and very high-power switching devices-particularly power MOSFET\x92s. These devices accept low-current digital inputs to activate a high-current, totem pole output which can source or sink a minimum of 6A.

Supply voltages for both VIN and VC can independently range from 4.7V to 18V. These devices also feature under-voltage lockout with hysteresis.

The UC1710 is packaged in an 8-pin hermetically sealed dual in-line package for \x9655°C to +125°C operation. The UC2710 and UC3710 are specified for a temperature range of \x9640°C to +85°C and 0°C to +70°C respectively and are available in either an 8-pin plastic dual in-line or a 5-pin, TO-220 package. Surface mount devices are also available.

The UC1710 family of FET drivers is made with a high-speed Schottky process to interface between low-level control functions and very high-power switching devices-particularly power MOSFET\x92s. These devices accept low-current digital inputs to activate a high-current, totem pole output which can source or sink a minimum of 6A.

Supply voltages for both VIN and VC can independently range from 4.7V to 18V. These devices also feature under-voltage lockout with hysteresis.

The UC1710 is packaged in an 8-pin hermetically sealed dual in-line package for \x9655°C to +125°C operation. The UC2710 and UC3710 are specified for a temperature range of \x9640°C to +85°C and 0°C to +70°C respectively and are available in either an 8-pin plastic dual in-line or a 5-pin, TO-220 package. Surface mount devices are also available.
filter Andere Low-Side-Treiber suchen
Herunterladen

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 1
Typ Titel Datum
* Data sheet High Current FET Driver datasheet 05 Sep 1999

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Alle Forenthemen auf Englisch anzeigen

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​