HD3SS6126
- Ideal for USB Applications
- Signal Switch for USB 3.0 (SuperSpeed USB
and USB 2.0 HS/FS/LS)
- Signal Switch for USB 3.0 (SuperSpeed USB
- Three Bidirectional Differential Pair Channel
MUX/DEMUX Switches Also Suitable for
DisplayPort, PCIe Gen1/2/3, SATA 1.5/3/6G, SAS
1.5/3/6G and XAUI Applications - Supports Data Rates up to 10 Gbps on High-
Bandwidth Path (SS) - VCC Operating Range 3.3 V ± 10%
- Wide –3-dB Differential BW of More Than 10 GHz
on High-Bandwidth Path (SS) - Uses a Unique Adaptation Method to Maintain a
Constant Channel Impedance Over the Supported
Common-Mode Voltage Range - Excellent High-bandwidth Path Dynamic
Characteristics (at 2.5 GHz)- Crosstalk = –35 dB
- Isolation = –23 dB
- Insertion Loss = –1.1 dB
- Return Loss = –11 dB
- Small 3.5 mm × 9 mm, 42-Pin WQFN Package
(RUA) - Active Mode Power = 8 mW
The HD3SS6126 device is a high-speed, passive switch that is designed for USB applications to route both SuperSpeed USB RX and TX and USB 2.0 DP and DM signals from a source to two destinations or vice versa. The device can also be used for DisplayPort, PCI-Express, SATA, SAS, and XAUI applications. The HD3SS6126 device can be used in either sink-side or source-side applications.
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檢視所有 3 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | HD3SS6126 USB 3.0 and USB 2.0 Differential Switch 2:1/1:2 MUX/DEMUX datasheet (Rev. A) | PDF | HTML | 2015年 8月 31日 |
| Application note | High-Speed Interface Layout Guidelines (Rev. J) | PDF | HTML | 2023年 2月 24日 | |
| EVM User's guide | HD3SS6126EVM Device Reference Design | 2013年 10月 17日 |
設計與開發
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開發板
HD3SS6126EVM — USB 3.0 差動開關 2:1 和 1:2 多工器和解多工器評估模組
This evaluation module (EVM) features the HD3SS6126 2:1 and 1:2 mux and demux, high-speed switch typically used for switching USB 2.0 and USB 3.0 signals. The EVM can also be used for PCIe (Gen1,Gen2), SATA, XAUI and DP signal routing between two destinations.
The HD3SS6126EVM lets (...)
使用指南: PDF
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使用指南: PDF
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| WQFN (RUA) | 42 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。