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USB IC
USB 轉接驅動器與多工器
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USB IC
USB 轉接驅動器與多工器

TS3USB30E

現行

具單啓用和 ESD 保護的高速 USB 2.0 1:2 多工器/解多工器開關

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產品規格表

TS3USB30E

現行
產品規格表 立即訂購

產品詳細資料

Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 Configuration 2:1 SPDT Features Logic Controlled (Output Enabled), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 1 ESD HBM (typ) (kV) 8 Bandwidth (MHz) 900
Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 Configuration 2:1 SPDT Features Logic Controlled (Output Enabled), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 1 ESD HBM (typ) (kV) 8 Bandwidth (MHz) 900
UQFN (RSW) 10 2.52 mm² 1.8 x 1.4 VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • VCC operation at 2.7V to 4.3V
  • D+/D– pins tolerate up to 5.25V
  • 1.8V compatible control-pin inputs
  • IOFF supports partial power-down-mode operation
  • RON = 10Ω maximum
  • ΔRON = 0.35Ω typical
  • Cio(ON) = 7.5pF typical
  • Low power consumption (70nA maximum)
  • –3dB bandwidth = 1400MHz typical
  • Latch-up performance exceeds 100mA per JESD 78, Class II (1)
  • ESD performance tested per JESD 22
    • 8000V human-body model (A114-B, Class II)
    • 1000V charged-device model (C101)
  • ESD performance I/O port to GND (2)
    • 15000V human-body model
  • Packaged in 10-pin UQFN (1.8mm × 1.4mm)

(1)Except OE and S inputs

(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.
  • VCC operation at 2.7V to 4.3V
  • D+/D– pins tolerate up to 5.25V
  • 1.8V compatible control-pin inputs
  • IOFF supports partial power-down-mode operation
  • RON = 10Ω maximum
  • ΔRON = 0.35Ω typical
  • Cio(ON) = 7.5pF typical
  • Low power consumption (70nA maximum)
  • –3dB bandwidth = 1400MHz typical
  • Latch-up performance exceeds 100mA per JESD 78, Class II (1)
  • ESD performance tested per JESD 22
    • 8000V human-body model (A114-B, Class II)
    • 1000V charged-device model (C101)
  • ESD performance I/O port to GND (2)
    • 15000V human-body model
  • Packaged in 10-pin UQFN (1.8mm × 1.4mm)

(1)Except OE and S inputs

(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.

The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1400MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB30E is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480Mbps).

The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8mm × 1.4mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.

The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1400MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB30E is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480Mbps).

The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8mm × 1.4mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.
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技術文件

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類型 標題 日期
* Data sheet TS3USB30E ESD-Protected, High-Speed USB 2.0 (480Mbps) 1:2 Multiplexer/Demultiplexer Switch With Single Enable datasheet (Rev. G) PDF | HTML 2024年 10月 28日
Application note Passive Mux Selection Based On Bandwidth (Rev. A) PDF | HTML 2024年 7月 31日
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 2018年 6月 14日

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TS3USB30E S-Parameter Model

SCDM186.ZIP (130 KB) - S-Parameter Model
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