UCC21222
-
Universal: dual low-side, dual high-side or halfbridge driver
- Junction temperature range –40 to +150°C
- Up to 4A peak source and 6A peak sink output
- Common-mode transient immunity (CMTI) greater than 125V/ns
- Up to 25V VDD output drive supply
- 8V, VDD UVLO options
- Switching parameters:
- 33ns typical propagation delay
- 5ns maximum pulse-width distortion
- 10µs maximum VDD power-up delay
- UVLO protection for all power supplies
- Fast disable for power sequencing
- Safety-related certifications (planned):
- 4242VPK isolation per DIN EN IEC 60747-17 (VDE 0884-17)
- 3000VRMS isolation for 1 minute per UL 1577
- CQC Certification per GB4943.1-2022
The UCC21222 is an isolated dual channel gate driver family with programmable dead time and wide temperature range. It is designed with 4A peak-source and 6A peak-sink current to drive power MOSFET, SiC, GaN, and IGBT transistors.
The UCC21222 can be configured as two low-side drivers, two high-side drivers, or a half-bridge driver. The input side is isolated from the two output drivers by a 3kVRMS isolation barrier, with a minimum of 125V/ns common-mode transient immunity (CMTI).
Protection features include: resistor programmable dead time, disable feature to shut down both outputs simultaneously, and integrated de-glitch filter that rejects input transients shorter than 5ns. All supplies have UVLO protection.
With all these advanced features, the UCC21222 device enables high efficiency, high power density, and robustness in a wide variety of power applications.
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
UCC21220EVM-009 — UCC21220 4A、6A 3.0kVRMS 隔離式雙通道閘極驅動器評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PMP41006 — 由 C2000™ 和 GaN 實現且具 CCM 圖騰柱 PFC 和電流模式 LLC 的 1-kW 參考設計
TIDA-010203 — 具 C2000 和 GaN 的 4-kW 單相圖騰柱 PFC 參考設計
PMP41043 — 由 C2000 和 GaN 實現且具 CCM 圖騰柱 PFC 和電流模式 LLC 的 1.6-kW 參考設計
相較於單迴路電壓模式控制 (VMC) 方法,HHC LLC 階段展示較佳的暫態回應與簡單控制迴路設計。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。