UCC27423-EP
- Industry-Standard Pinout
- Enable Functions for Each Driver
- High Current-Drive Capability of ±4 A
- Unique Bipolar and CMOS True-Drive Output
Stage Provides High Current at MOSFET Miller
Thresholds - TTL-/CMOS-Compatible Inputs Independent of
Supply Voltage - 20-ns Typical Rise and 15-ns Typical Fall Times
With 1.8-nF Load - Typical Propagation Delay Times of 25 ns
With Input Falling and 35 ns With Input Rising - 4.5-V to 15-V Supply Voltage
- Dual Outputs can be Paralleled for Higher Drive
Current - Available in Thermally-Enhanced MSOP
PowerPAD™ Package With 4.7°C/W RθJC - Supports Defense, Aerospace, and Medical
Applications- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
- APPLICATIONS
- Switch-Mode Power Supplies
- DC/DC Converters
- Motor Controllers
- Line Drivers
- Class-D Switching Amplifiers
All other trademarks are the property of their respective owners
The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.
Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.
The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left open for standard operation.
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點