UCC27425
- Industry-Standard Pin-Out
- Enable Functions for Each Driver
- High Current Drive Capability of ±4 A
- Unique BiPolar and CMOS True Drive Output Stage Provides High Current at MOSFET Miller Thresholds
- TTL/CMOS Compatible Inputs Independent of Supply Voltage
- 20-ns Typical Rise and 15-ns Typical Fall Times with 1.8-nF Load
- Typical Propagation Delay Times of 25 ns with Input Falling and 35 ns with Input Rising
- 4-V to 15-V Supply Voltage
- Dual Outputs Can Be Paralleled for Higher Drive Current
- Available in Thermally Enhanced MSOP PowerPAD™ Package
- Rated From –40°C to 125°C
The UCC2742x family of high-speed dual MOSFET drivers can deliver large peak currents into capacitive loads. Three standard logic options are offered – dual-inverting, dual-noninverting, and one-inverting and one-noninverting driver. The thermally enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. It is also offered in the standard SOIC-8 (D) or PDIP-8 (P) packages.
Using a design that inherently minimizes shoot-through current, these drivers deliver 4A of current where it is needed most at the Miller plateau region during the MOSFET switching transition. A unique BiPolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.
The UCC2742x provides enable (ENB) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8 which were previously left unused in the industry standard pin-out. They are internally pulled up to V DD for active high logic and can be left open for standard operation.
您可能會感興趣的類似產品
引腳對引腳且具備與所比較裝置相同的功能
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
UCC27423-4-5-Q1EVM — 具有啟用功能的 UCC2742xQ1 雙路 4A 高速低壓側 MOSFET 驅動器評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HVSSOP (DGN) | 8 | Ultra Librarian |
PDIP (P) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。