LDC1314EVM
LDC1314 評価モジュール
LDC1314EVM
概要
The LDC1314 Evaluation Module demonstrates the use of inductive sensing technology to sense and measure the presence, position or composition of a conductive target object. The module includes two example PCB sensor coils but can connect to the four channels of the LDC1314. An MSP430 microcontroller is used to interface the LDC to a host computer.
This module is designed to provide the user with maximum flexibility for system prototyping. It is perforated at two locations: one, between the PCB sensor coil (LC tank) and the LDC1314, and another, between the LDC1314 and the MSP430 interface. The first perforation gives the user the option to snap off the PCB coils from the module and experiment with custom sensor coils. The second perforation allows the user to connect the LDC1314 and sensor coils to a different microcontroller system or use multiple such sensors in one system.
An accompanying GUI allows for maximum flexibility and quick system prototyping.
特長
- Multiple board perforations: provide maximum evaluation and system design flexibility
- Includes example sensor coils for the different channels
- Operates via PC
- Accompanying GUI for quick concept demonstration and data capture
- EVM design accelerates prototyping of end application
誘導形近接センサ対応 AFE
購入と開発の開始
LDC1314EVM — LDC1314 評価モジュール
SNOC028 — Sensing Solutions EVM GUI Tool v1.10.0
SNOC028 — Sensing Solutions EVM GUI Tool v1.10.0
製品
湿度センサ
誘導形近接センサ対応 AFE
シグナル・コンディショナ
ハードウェア開発
評価ボード
リリース情報
設計ファイル
技術資料
| 種類 | タイトル | 英語版のダウンロード | 日付 | |||
|---|---|---|---|---|---|---|
| * | EVM ユーザー ガイド (英語) | LDC131x and LDC161x EVM User’s Guide (Rev. A) | 2016年 9月 21日 | |||
| 証明書 | LDC1314EVM, LDC1614EVM EC Declaration of Conformity (DoC) (Rev. A) | 2019年 1月 2日 | ||||
| 技術記事 | Inductive sensing: Improve the ENOB of a multichannel LDC by 4 bits in 3 simple st | PDF | HTML | 2015年 6月 24日 |