The LP8733xx is designed to meet the power management requirements in industrial applications. The device has two step-down DC/DC converters (which can be configured as a single dual-phase regulator or two single-phase regulators), two linear regulators, and two general-purpose digital-output signals. The device is controlled by an I2C-compatible serial interface and by an enable signal.
The automatic PWM/PFM (AUTO mode) operation together with the automatic phase adding/shedding gives high efficiency over a wide output-current range. The LP8733xx supports remote voltage sensing (differential in dual-phase configuration) to compensate IR drop between the regulator output and the point-of-load (POL), thus improving the accuracy of the output voltage. In addition, the switching clock can be forced to PWM mode and also synchronized to an external clock to minimize the disturbances.
The LP8733xx device supports programmable start-up and shutdown delays and sequences including GPO signals synchronized to the enable signal. During start-up and voltage change, the device controls the output slew rate to minimize output voltage overshoot and the in-rush current.
Lösungen erkunden, die den LP8733 umfassen. TI bietet Stromversorgungslösungen für Ein-Chip-Systeme (SoCs), Prozessoren, Mikrocontroller, Sensoren und feldprogrammierbare Gate-Arrays (FPGAs) von TI und von Fremdherstellern an.
The LP87330Q1EVM demonstrates the integrated circuit LP873300-Q1 from Texas Instruments.
The LP873300-Q1 has two high-performance step-down converters and two LDOs, designed to meet the power management requirements of the latest applications processors in automotive applications. The LP873300-Q1 is (...)
VVDN ist ein Drittanbieter, welcher System-auf-Modul (SOM) entwickelt, um zu demonstrieren, dass PMICs von TI für die Stromversorgung von NXP-Prozessoren optimiert werden können. Diese SOMs sind voll ausgestattete, hochleistungsfähige und kostengünstige Platinen mit (...)
The Processor and MCU+ SDKs (Software Development Kits) are unified software platforms for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of these SDKs are consistent across TI’s broad portfolio for which they are provided, (...)
| Gehäuse | Pins | CAD-Symbole, Footprints und 3D-Modelle |
|---|---|---|
| VQFN (RHD) | 28 | Ultra Librarian |
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Processor SDK LINUX AM64x - Linux Installer for sources, pre-built binaries and file system images generated using Yocto build environment
Processor SDK LINUX AM64x Yocto - SD card image
Processor SDK LINUX AM64x Debian Trixie - SD card image
Learn how to build embedded Linux systems using AM64x processors
Learn how to build embedded systems using AM64x processors
Yocto SDK user manual for developers
Instructions to build Linux image for AM64x Starter Kit (SK) using Yocto build environment
Get the various Linux Performance Benchmarks for this release
Debian SDK manual for developers with build instructions
Software manifest - Processor SDK AM64x for Debian Linux
Software manifest - Processor SDK AM64x for Yocto Linux
Build Sheet of supported features for AM64x
Thank you for your interest in PROCESSOR SDK LINUX AM64x Software Development Kit (SDK). This SDK is a Linux only package. The Processor SDK is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly reuse and develop software across devices.
This release adds support for production Silicon Release 2.0 High Security - Field Securable (HS-FS) devices.
TI Linux CI/CD Snapshot
In order to improve access to the very latest bug fixes and feature enhancements, TI is enabling Continuous Integration and Continuous Deployment (CI/CD) for AM64x processors. The patches for these changes have always been available on public repositories hosted on git.ti.com, and these source repositories could be built using the Yocto build environment on a daily basis. The new TI Linux CI/CD Snapshot makes it even easier to consume these changes with pre-built binaries of Linux boot images to try out on TI Evaluation Modules (EVMs and SKs) before migrating or picking the patches. A detailed test report is also published to help users understand the status of the build and features being validated. The Linux boot images from a snapshot can be regenerated using sources by following the build instructions provided on the snapshot page.
The daily snapshot is not a replacement for the official Processors SDK releases which have full documentation, training and support. The snapshot is a new easy way to try bug fixes and feature enhancements planned for the next SDK while enabling much more tighter integration with customizations and application development. This improved integration should allow users to release their customized code built on the SDKs more quickly and confidently.