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CSD95373BQ5M

ACTIVO

Etapa de potencia inteligente NexFET™ de reductor síncrono de 45 A

Detalles del producto

VDS (V) 20 Ploss current (A) 25 Rating Catalog Operating temperature range (°C) -55 to 150
VDS (V) 20 Ploss current (A) 25 Rating Catalog Operating temperature range (°C) -55 to 150
LSON-CLIP (DQP) 12 30 mm² 6 x 5
  • 45-A Continuous Operating Current Capability
  • 92.7% System Efficiency at 25 A
  • Low-Power Loss of 2.6 W at 25 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output (600 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density SON 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 45-A Continuous Operating Current Capability
  • 92.7% System Efficiency at 25 A
  • Low-Power Loss of 2.6 W at 25 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output (600 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density SON 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95373BQ5M NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95373BQ5M NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Documentación técnica

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* Data sheet CSD95373BQ5M Synchronous Buck NexFET Smart Power Stage datasheet (Rev. A) PDF | HTML 12 jul 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Diseños de referencia

PMP10393 — Diseño de referencia de convertidor buck CC-CC de alta densidad de 600 mV y 200 A de 5-6 fases con i

Advanced DCAP+ control is used to provide the high speed dynamic control needed for CPU, Memory and ASIC applications. Up to six high current synchronous power stages provide the high currents and low losses needed for these applications. Multi-phase also allows output ripple cancellation and (...)
Test report: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
LSON-CLIP (DQP) 12 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

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