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LMZ31506

ACTIVO

Módulo de alimentación reductor de 4,5 V a 15 V, 6 A en paquete QFN de 9 x 15 x 2,8 mm

Detalles del producto

Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 6 Vin (min) (V) 2.95 Vin (max) (V) 14.5 Vout (min) (V) 0.6 Vout (max) (V) 5.5 Switching frequency (min) (kHz) 250 Switching frequency (max) (kHz) 780 Features Current Sharing, EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Control mode current mode Duty cycle (max) (%) 100
Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 6 Vin (min) (V) 2.95 Vin (max) (V) 14.5 Vout (min) (V) 0.6 Vout (max) (V) 5.5 Switching frequency (min) (kHz) 250 Switching frequency (max) (kHz) 780 Features Current Sharing, EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Control mode current mode Duty cycle (max) (%) 100
B1QFN (RUQ) 47 135 mm² 15 x 9
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9-mm × 15-mm × 2.8-mm package
    - Pin Compatible with LMZ31503
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.6 V to 5.5 V, with 1% Reference Accuracy
  • Supports Parallel Operation for Higher Current
  • Optional Split Power Rail Allows
    Input Voltage down to 1.6 V
  • Adjustable Switching Frequency
    (250 kHz to 780 kHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection (Hiccup Mode)
  • Over-Temperature Protection
  • Pre-bias Output Start-up
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 13°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ31506 With the WEBENCH® Power Designer
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9-mm × 15-mm × 2.8-mm package
    - Pin Compatible with LMZ31503
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.6 V to 5.5 V, with 1% Reference Accuracy
  • Supports Parallel Operation for Higher Current
  • Optional Split Power Rail Allows
    Input Voltage down to 1.6 V
  • Adjustable Switching Frequency
    (250 kHz to 780 kHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection (Hiccup Mode)
  • Over-Temperature Protection
  • Pre-bias Output Start-up
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 13°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ31506 With the WEBENCH® Power Designer

The LMZ31506 power module is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.

The LMZ31506 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

The LMZ31506 power module is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.

The LMZ31506 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

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Documentación técnica

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Tipo Título Fecha
* Data sheet LMZ31506 6-A Power Module, 2.95V-14.5V Input and Current Sharing datasheet (Rev. B) 11 abr 2018
Application note Soldering Considerations for Power Modules (Rev. C) PDF | HTML 14 mar 2024
Selection guide Innovative DC/DC Power Modules Selection Guide (Rev. D) 14 oct 2021
Application note Soldering Requirements for BQFN Packages (Rev. C) 05 mar 2020
Application note Working With QFN Power Modules (Rev. A) 08 jun 2017
Application note Adjusting LMZ3 Output Voltage with LM10010/1 11 feb 2014
Application note LMZ31506 Parallel Operation 02 jul 2013
Application note Powering LMZ3 SIMPLE SWITCHER Power Modules From 3.3 V 02 jul 2013
EVM User's guide Using the LMZ31506EVM, LMZ31503EVM, LMZ31506HEVM 02 jul 2013

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

LMZ31506EVM-692 — Placa de evaluación del módulo de alimentación reductor LMZ31506 de 4,5 V a 14,5 V, 6 A

The Texas Instruments LMZ31506EVM-692 evaluation module (EVM) is a fully assembled and tested circuit for evaluating the LMZ31506 6A power module. The output voltage can be selected from six preset values using a jumper (5V, 3.3V, 2.5V, 1.8V, 1.5V, 1.2V). Solder pads and jumpers are available to (...)
Guía del usuario: PDF
Modelo de simulación

LMZ31506 PSpice Average Model

SLVMAF7.ZIP (96 KB) - PSpice Model
Modelo de simulación

LMZ31506 Unencrypted PSpice Average Model

SNVM790.ZIP (1 KB) - PSpice Model
Modelo de simulación

TPS84621 TINA-TI Transient Spice Model

SLVM594.ZIP (68 KB) - TINA-TI Spice Model
Modelo de simulación

TPS84621 Unencrypted PSpice Transient Model Package (Rev. A)

SLVM558A.ZIP (60 KB) - PSpice Model
Diseños de referencia

PMP10601 — Solución de alimentación Xilinx® Zynq® 7000 series (XC7Z015), 8 W - Diseño de referencia

The PMP10601 reference design provides all the power supply rails necessary to power Xilinx® Zynq® 7000 series (XC7Z015)  FPGA.   This design uses several LMZ3 series modules, LDOs, and a DDR termination regulator to provide all the necessary rails to power the FPGA.  It also (...)
Test report: PDF
Esquema: PDF
Diseños de referencia

PMP9353 — Diseño de referencia de fuente de alimentación Altera Cyclone V SoC

The PMP9353 reference design is a complete power solution for Altera Cyclone V SoC devices. This design uses several LMZ3 series modules , two LDOs, and a DDR termination regulator to provide all the necessary rails to power the SoC chip. This design also shows correct power-up sequencing.
Test report: PDF
Esquema: PDF
Diseños de referencia

PMP9444 — Diseño de referencia de solución de potencia de Xilinx Kintex UltraScale FPGA con PMBus

The PMP9444 reference design provides all the power supply rails necessary to power Xilinx's Kintex UltraScale family of FPGAs.  It features two UCD90120A's for flexible power up and power down sequencing as well as voltage monitoring, current monitoring, and voltage margining through the (...)
Test report: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
B1QFN (RUQ) 47 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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