The TPS84621 is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 9×15×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.
The TPS84621 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TPS84621 2.95-V to 14.5-V Input, 6-A Synchronous Buck, Integrated Power Solution datasheet (Rev. E) | 10 abr 2018 | |
| Application note | Soldering Requirements for BQFN Packages (Rev. C) | 05 mar 2020 | ||
| Selection guide | Power Management Guide 2018 (Rev. R) | 25 jun 2018 | ||
| Test report | TI Power Reference Design for Xilinx® Artix®-7 (AC701) | 12 may 2014 | ||
| User guide | PMP7977 User's Guide | 11 sep 2013 | ||
| Application note | AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A) | 23 abr 2013 | ||
| Application note | TPS84621 Parallel Operation | 22 ene 2013 | ||
| Application note | Powering TPS84k Devices from 3.3 V | 04 ene 2013 | ||
| More literature | TPS84k Integrated Power Modules Info Card (Rev. A) | 28 ago 2012 | ||
| User guide | TPS84620EVM-692 6-A, Integrated Power Solution EVM (Rev. A) | 24 ago 2011 | ||
| More literature | SEM1600 Topic 4: Constructing Your Power Supply – Layout Considerations | 12 jul 2005 | ||
| Application note | AN-643 EMI/RFI Board Design (Rev. B) | 03 may 2004 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| B1QFN (RUQ) | 47 | Ultra Librarian |
El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.
Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI.