TPS22932B
- Input Voltage: 1.1 V to 3.6 V
- Ultralow ON-Resistance
- rON = 55 mΩ at VIN = 3.6 V
- rON = 65 mΩ at VIN = 2.5 V
- rON = 75 mΩ at VIN = 1.8 V
- rON = 115 mΩ at VIN = 1.2 V
- 500-mA Maximum Continuous Switch Current
- Quiescent Current < 1 µA
- Shutdown Current < 1 µA
- Low Control Threshold Allows Use of 1.2-V, 1.8-V,
2.5-V, and 3.3-V Logic - Configurable Enable Logic
- Controlled Slew Rate to Avoid Inrush Currents:
165 µs at 1.8 V - Six-Terminal Wafer Chip Scale Package (DSBGA)
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
- APPLICATIONS
- PDAs
- Cell Phones
- GPS Devices
- MP3 Players
- Digital Cameras
- Peripheral Ports
- Portable Instrumentation
All other trademarks are the property of their respective owners
The TPS22932B device is a low rON load switch with controlled turnon. The device contains a P-channel MOSFET that can operate over an input voltage range of 1.1 V to 3.6 V.
The switch is controlled by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All inputs can be connected to VIN or GND. The control pins can be connected to low-voltage GPIOs allowing the switch to be controlled by either 1.2-V, 1.8-V, 2.5-V, or 3.3-V logic signals while keeping extremely low quiescent current.
A 120-Ω on-chip load resistor is available for output quick discharge when the switch is turned off. The rise time (slew rate) of the device is internally controlled to avoid inrush current: the rise time of TPS22932B is 165 µs.
TPS22932B is available in a space-saving 6-pin DSBGA (YFP with 0.4-mm pitch). The device is characterized for operation over the free-air temperature range of –40°C to 85°C.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TPS22932B Low Input Voltage, Ultralow rON Load Switch With Configurable Enable Logic and Controlled Slew-Rate datasheet (Rev. C) | PDF | HTML | 2015/05/29 |
| Application note | Load Switch Thermal Considerations (Rev. A) | 2018/10/11 | ||
| Application note | Basics of Load Switches (Rev. A) | 2018/09/05 | ||
| Application note | Selecting a Load Switch to Replace a Discrete Solution | 2017/04/30 | ||
| Application note | Timing of Load Switches | 2017/04/27 | ||
| Application note | Managing Inrush Current (Rev. A) | 2015/05/28 | ||
| User guide | TPS22931/32/32B Evaluation Module | 2009/01/19 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| DSBGA (YFP) | 6 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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