Inicio Gestión de la energía Power stages Etapas de potencia de nitruro de galio (GaN)

LMG3100R044

ACTIVO

FET de GaN de 100 V y 4.4 mΩ con controlador integrado

Detalles del producto

VDS (max) (V) 100 RDS(on) (mΩ) 4.4 ID (max) (A) 35 Features Built-in bootstrap diode, Integrated FET, Top-side cooled, UVLO Rating Catalog Operating temperature range (°C) -40 to 125
VDS (max) (V) 100 RDS(on) (mΩ) 4.4 ID (max) (A) 35 Features Built-in bootstrap diode, Integrated FET, Top-side cooled, UVLO Rating Catalog Operating temperature range (°C) -40 to 125
VQFN-FCRLF (VBE) 15 26 mm² 6.5 x 4
  • Integrated 1.7mΩ (LMG3100R017) or 4.4 mΩ (LMG3100R044) GaN FET and driver
  • 100V continuous, 120V pulsed voltage rating
  • Interated high-side level shift and bootstrap
  • Two LMG3100 can form a half-bridge
    • No external level shifter needed
  • 5V external bias power supply
  • Supports 3.3V and 5V input logic levels
  • High slew rate switching with low ringing
  • Gate driver capable of up to 10MHz switching
  • Internal bootstrap supply voltage clamping to prevent GaN FET overdrive
  • Supply rail undervoltage lockout protection
  • Low power consumption
  • Package optimized for easy PCB layout
  • Exposed top QFN package for top-side cooling
  • Large exposed pads at bottom for bottom-side cooling
  • Integrated 1.7mΩ (LMG3100R017) or 4.4 mΩ (LMG3100R044) GaN FET and driver
  • 100V continuous, 120V pulsed voltage rating
  • Interated high-side level shift and bootstrap
  • Two LMG3100 can form a half-bridge
    • No external level shifter needed
  • 5V external bias power supply
  • Supports 3.3V and 5V input logic levels
  • High slew rate switching with low ringing
  • Gate driver capable of up to 10MHz switching
  • Internal bootstrap supply voltage clamping to prevent GaN FET overdrive
  • Supply rail undervoltage lockout protection
  • Low power consumption
  • Package optimized for easy PCB layout
  • Exposed top QFN package for top-side cooling
  • Large exposed pads at bottom for bottom-side cooling

The LMG3100 device is a 100V continuous, 120V pulsed Gallium Nitride (GaN) FET with integrated driver. Device is offered in two Rds(on) and max current variants, 126A/1.7mΩ for LMG3100R017 and 46A/4.4mΩ for LMG3100R044. The device consists of a 100V GaN FET driven by a high-frequency GaN FET driver. The LMG3100 incorporates a high side level shifter and bootstrap circuit, so that two LMG3100 devices can be used to form a half bridge without an additional level shifter.

GaN FETs provide significant advantages for power conversion as they have zero reverse recovery and very small input capacitance CISS and output capacitance COSS. The driver and the GaN FET are mounted on a completely bond-wire free package platform with minimized package parasitic elements. The LMG3100 device is available in a 6.5mm × 4mm × 0.89mm lead-free package and can be easily mounted on PCBs.

The TTL logic compatible inputs can support 3.3V and 5V logic levels regardless of the VCC voltage. The proprietary bootstrap voltage clamping technique ensures the gate voltages of the enhancement mode GaN FETs are within a safe operating range.

The device extends advantages of discrete GaN FETs by offering a more user-friendly interface. It is an ideal solution for applications requiring high-frequency, high-efficiency operation in a small form factor.

The LMG3100 device is a 100V continuous, 120V pulsed Gallium Nitride (GaN) FET with integrated driver. Device is offered in two Rds(on) and max current variants, 126A/1.7mΩ for LMG3100R017 and 46A/4.4mΩ for LMG3100R044. The device consists of a 100V GaN FET driven by a high-frequency GaN FET driver. The LMG3100 incorporates a high side level shifter and bootstrap circuit, so that two LMG3100 devices can be used to form a half bridge without an additional level shifter.

GaN FETs provide significant advantages for power conversion as they have zero reverse recovery and very small input capacitance CISS and output capacitance COSS. The driver and the GaN FET are mounted on a completely bond-wire free package platform with minimized package parasitic elements. The LMG3100 device is available in a 6.5mm × 4mm × 0.89mm lead-free package and can be easily mounted on PCBs.

The TTL logic compatible inputs can support 3.3V and 5V logic levels regardless of the VCC voltage. The proprietary bootstrap voltage clamping technique ensures the gate voltages of the enhancement mode GaN FETs are within a safe operating range.

The device extends advantages of discrete GaN FETs by offering a more user-friendly interface. It is an ideal solution for applications requiring high-frequency, high-efficiency operation in a small form factor.

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Documentación técnica

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* Data sheet LMG3100R017 (126A), LMG3100R044 (46A) 100V GaN FET With Integrated Driver datasheet (Rev. B) PDF | HTML 11 nov 2024

Diseño y desarrollo

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Placa de evaluación

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VQFN-FCRLF (VBE) 15 Ultra Librarian

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  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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