TPS50601-SP
Convertidor reductor síncrono QMLV reforzado contra la radiación, entrada de 3 V a 6.3 V, 6 A
Se encuentra disponible una versión más nueva de este producto
Misma funcionalidad con diferente configuración de pines que el dispositivo comparado
TPS50601-SP
- 5962R10221:
- Radiation Hardness Assurance (RHA) up to TID 100 krad (Si)
- ELDRS Free 100 krad (Si) – 10 mRAD(Si)/s
- Single Event Latchup (SEL) Immune to
LET = 85 MeV-cm2/mg (See Radiation Report, http://www.ti.com/radiation) - SEB and SEGR Immune to 85 MeV-cm2/mg, SOA Curve Available (See Radiation Report)
- SET/SEFI Cross-Section Plot Available (See Radiation Report)
- Peak Efficiency: 95% (VO = 3.3 V)
- Integrated 55-mΩ/50-mΩ MOSFETs
- Split Power Rail: 1.6 to 6.3 V on PVIN
- Power Rail: 3 to 6.3 V on VIN
- 6-A Maximum Output Current
- Flexible Switching Frequency Options:
- 100-kHz to 1-MHz Adjustable Internal Oscillator
- External Sync Capability: 100 kHz to 1 MHz
- Sync Pin can be Configured as a 500-kHz Output for Master/Slave Applications
- 0.795-V ±1.258% Voltage Reference at 25°C
- Monotonic Start-Up into Prebiased Outputs
- Adjustable Soft Start Through External Capacitor
- Input Enable and Power-Good Output for Power Sequencing
- Power Good Output Monitor for Undervoltage and Overvoltage
- Adjustable Input Undervoltage Lockout (UVLO)
- 20-Pin Thermally-Enhanced Ceramic Flatpack Package (HKH)
- See www.ti.com/swift for SWIFT Documentation
- See the Tools & Software Tab
The TPS50601-SP is a radiation hardened, 6.3-V, 6-A synchronous step-down converter, which is optimized for small designs through high efficiency and integrating the high-side and low-side MOSFETs. Further space savings are achieved through current mode control, which reduces component count, and a high switching frequency, reducing the inductor's footprint. The devices are offered in a thermally enhanced 20-pin ceramic, dual in-line flatpack package.
The output voltage startup ramp is controlled by the SS/TR pin which allows operation as either a stand alone power supply or in tracking situations. Power sequencing is also possible by correctly configuring the enable and the open drain power good pins.
Cycle-by-cycle current limiting on the high-side FET protects the device in overload situations and is enhanced by a low-side sourcing current limit which prevents current runaway. There is also a low-side sinking current limit which turns off the low-side MOSFET to prevent excessive reverse current. Thermal shutdown disables the part when die temperature exceeds thermal shutdown temperature.
Documentación técnica
Diseño y desarrollo
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
TPS50601SPEVM-D — Módulo de evaluación de doble funcionamiento TPS50601-SP
The TPS50601-SP DC/DC converter is designed to provide up to a 6-A output in single phase operation (TPS50601SPEVM-S) and up to 12 A in dual phase operation (TPS50601SPEVM-D), when each phase is configured to provide 6-A per phase.
TPS50601SPEVM-D can also be configured such that each phase (...)
TPS50601SPEVM-S — Módulo de evaluación de funcionamiento simple TPS50601-SP
The TPS50601-SP DC/DC converter is designed to provide up to a 6-A output in single phase operation (TPS50601SPEVM-S) and up to 12 A in dual phase operation (TPS50601SPEVM-D), when each phase is configured to provide 6-A per phase.
TPS50601SPEVM-D can also be configured such that each phase (...)
TPS50601-SP TINA Unencrypted Transient Model
TPS50601-SP TINA-TI Average Reference Design
TPS50601-SP TINA-TI Average Spice Model
TPS50601-SP TINA-TI Transient Reference Design
TPS50601-SP TINA-TI Transient Spice Model
TPS50601-SP Unencrypted TINA Average Model Package
Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
---|---|---|
CFP (HKH) | 20 | Ultra Librarian |
DIESALE (KGD) | — |
Pedidos y calidad
- RoHS
- REACH
- Marcado del dispositivo
- Acabado de plomo/material de la bola
- Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
- Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
- Contenido del material
- Resumen de calificaciones
- Monitoreo continuo de confiabilidad
- Lugar de fabricación
- Lugar de ensamblaje
Soporte y capacitación
Foros de TI E2E™ con asistencia técnica de los ingenieros de TI
El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.
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