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Módulos de alimentación (inductor integrado)

TPSM63602

ACTIVO

Módulo reductor de 2 A con entrada de 3 V a 36 V y salida de 1 V a 16 V en encapsulado de 4 mm x 6 m

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TPSM63602

ACTIVO
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Detalles del producto

Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Type Module Iout (max) (A) 2 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 16 Switching frequency (min) (kHz) 200 Switching frequency (max) (kHz) 2200 EMI features Integrated capacitors, Low parasitic Hotrod packaging Features EMI Tested, Enable, Frequency synchronization, Overcurrent protection, Power good Control mode current mode Duty cycle (max) (%) 98
Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Type Module Iout (max) (A) 2 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 16 Switching frequency (min) (kHz) 200 Switching frequency (max) (kHz) 2200 EMI features Integrated capacitors, Low parasitic Hotrod packaging Features EMI Tested, Enable, Frequency synchronization, Overcurrent protection, Power good Control mode current mode Duty cycle (max) (%) 98
B0QFN (RDH) 30 24 mm² 6 x 4
  • Versatile synchronous buck DC/DC module
    • Integrated MOSFETs, inductor, and controller
    • Wide input voltage range of 3 V to 36 V
    • Adjustable output voltage from 1 V to 16 V
    • 4-mm × 6-mm × 1.8-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz using the RT pin or an external SYNC signal
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • 93% peak efficiency at 12 VIN, 5 VOUT, 1 MHz
    • External bias option for improved efficiency
    • Shutdown quiescent current of 0.6 µA (typical)
    • 0.3-V typical dropout voltage at 2-A load
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Resistor-adjustable switch-node slew rate
    • Constant-frequency FPWM mode of operation
    • Meets CISPR 11 and 32 class B emissions
  • Suitable for scalable power supplies
    • Pin compatible with the TPSM63603 (36 V, 3 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63602 with the WEBENCH Power Designer
  • Versatile synchronous buck DC/DC module
    • Integrated MOSFETs, inductor, and controller
    • Wide input voltage range of 3 V to 36 V
    • Adjustable output voltage from 1 V to 16 V
    • 4-mm × 6-mm × 1.8-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz using the RT pin or an external SYNC signal
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • 93% peak efficiency at 12 VIN, 5 VOUT, 1 MHz
    • External bias option for improved efficiency
    • Shutdown quiescent current of 0.6 µA (typical)
    • 0.3-V typical dropout voltage at 2-A load
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Resistor-adjustable switch-node slew rate
    • Constant-frequency FPWM mode of operation
    • Meets CISPR 11 and 32 class B emissions
  • Suitable for scalable power supplies
    • Pin compatible with the TPSM63603 (36 V, 3 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63602 with the WEBENCH Power Designer

The TPSM63602 synchronous buck power module is a highly integrated 36-V, 2-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has pins for VIN and VOUT located at the corners of the package for optimized input and output capacitor layout placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 16 V, the TPSM63602 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63602 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate for improved EMI, integrated VCC, bootstrap and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range for enhanced load transient performance, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

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The TPSM63602 synchronous buck power module is a highly integrated 36-V, 2-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has pins for VIN and VOUT located at the corners of the package for optimized input and output capacitor layout placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 16 V, the TPSM63602 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63602 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate for improved EMI, integrated VCC, bootstrap and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range for enhanced load transient performance, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

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TLVM13620 ACTIVO Módulo reductor de 3.6 V a 36 V de entrada, 1 V a 6 V de salida, 2 A, en encapsulado de 4 mm x 6 mm  Reduced feature set and output voltage range.

Documentación técnica

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* Data sheet TPSM63602 High-Density, 3-V to 36-V Input, 1-V to 16-V Output, 2-A Power Module With Enhanced HotRod™ QFN Package datasheet PDF | HTML 28 abr 2022

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TPSM63603EVM — Placa de evaluación TPSM63603 de módulo de alimentación con entrada de 3 V a 36 V y salida de 1 V a

La placa de evaluación TPSM63603EVM está configurada para evaluar el funcionamiento del módulo de alimentación TPSM63603. El rango de tensión de entrada es de 3 V a 36 V. El rango de tensión de salida es de 1 V a 16 V. La placa de evaluación facilita evaluar el funcionamiento de TPSM63603.

La placa (...)
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Herramienta de cálculo

TPSM6360XDESIGN-CALC — Herramienta de cálculo rápido del módulo de alimentación de la familia TPSM6360X

Welcome to the TPSM63602, TPSM63603, TPSM63604 and TPSM63606 power module quickstart design tool. This standalone tool facilitates and assists the power supply engineer with the design of a DC/DC buck regulator based on this family of synchronous buck power modules. As such, the user can (...)
Guía del usuario: PDF | HTML
Guía del usuario: PDF | HTML
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
B0QFN (RDH) 30 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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