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TPSM82866C

ACTIVO

Módulo de potencia reductor de 6 A y entrada de 5.5 V con inductor integrado e interfaz I2C en QF

Detalles del producto

Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 6 Vin (min) (V) 2.4 Vin (max) (V) 5.5 Vout (min) (V) 0.4 Vout (max) (V) 3.35 Switching frequency (min) (kHz) 2200 Switching frequency (max) (kHz) 2500 Features Digital/I2C compatible, Dynamic voltage scaling, EMI Tested, Enable, Fast load transient support, Fixed PWM Mode, Forced PWM, I2C, I2C Config, I2C bus interface, I2C control, I2C control method, I2C controlled, I2C interface, I2C or GPIO control, I2C support, I2C/PMBus, Light Load Efficiency, MagPack technology, Output discharge, Overcurrent protection, Synchronous Rectifier, Telemetry, Thermal Error Flag, Thermal monitor, Thermal shutdown, Thermal warning, UVLO, UVLO fixed, Undervoltage Lock Out (UVLO), Undervoltage protection, Undervotlage protection, Voltage scaling Control mode Constant on-time (COT), DCS-Control Duty cycle (max) (%) 100
Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 6 Vin (min) (V) 2.4 Vin (max) (V) 5.5 Vout (min) (V) 0.4 Vout (max) (V) 3.35 Switching frequency (min) (kHz) 2200 Switching frequency (max) (kHz) 2500 Features Digital/I2C compatible, Dynamic voltage scaling, EMI Tested, Enable, Fast load transient support, Fixed PWM Mode, Forced PWM, I2C, I2C Config, I2C bus interface, I2C control, I2C control method, I2C controlled, I2C interface, I2C or GPIO control, I2C support, I2C/PMBus, Light Load Efficiency, MagPack technology, Output discharge, Overcurrent protection, Synchronous Rectifier, Telemetry, Thermal Error Flag, Thermal monitor, Thermal shutdown, Thermal warning, UVLO, UVLO fixed, Undervoltage Lock Out (UVLO), Undervoltage protection, Undervotlage protection, Voltage scaling Control mode Constant on-time (COT), DCS-Control Duty cycle (max) (%) 100
QFN-FCMOD (RCF) 15 6.9 mm² 2.3 x 3
  • Up to 96% efficiency
  • Excellent thermal performance
  • I2C-compatible interface up to 3.4Mbps
  • 1% output voltage accuracy
  • DCS-Control topology for fast transient response
  • I2C programmable:
    • Output voltage
      • 0.4 – 1.675V in 5mV steps
      • 0.8 – 3.35V in 10mV steps
    • Forced PWM or power save mode
    • Output voltage discharge
  • I2C device status readback of:
    • Thermal warning
    • Hiccup current limit
    • Vin below UVLO
  • Resistor selectable:
    • I2C address
    • 16 start-up output voltage options
  • Optimized for low EMI requirements
    • No bond wire package
    • MagPack technology shields inductor and IC
    • Simplified layout through optimized pinout
  • 4µA operating quiescent current
  • –40°C to 125°C operating temperature range
  • 2.3mm × 3.0mm × 1.95mm QFN package
  • 28mm2 design size
  • Also available without I2C interface: TPSM82866A
  • Up to 96% efficiency
  • Excellent thermal performance
  • I2C-compatible interface up to 3.4Mbps
  • 1% output voltage accuracy
  • DCS-Control topology for fast transient response
  • I2C programmable:
    • Output voltage
      • 0.4 – 1.675V in 5mV steps
      • 0.8 – 3.35V in 10mV steps
    • Forced PWM or power save mode
    • Output voltage discharge
  • I2C device status readback of:
    • Thermal warning
    • Hiccup current limit
    • Vin below UVLO
  • Resistor selectable:
    • I2C address
    • 16 start-up output voltage options
  • Optimized for low EMI requirements
    • No bond wire package
    • MagPack technology shields inductor and IC
    • Simplified layout through optimized pinout
  • 4µA operating quiescent current
  • –40°C to 125°C operating temperature range
  • 2.3mm × 3.0mm × 1.95mm QFN package
  • 28mm2 design size
  • Also available without I2C interface: TPSM82866A

The TPSM8286xx device family consists of 4A and 6A step-down converter power modules designed for small design size and high efficiency. The power modules uses TI’s MagPack technology to integrate a synchronous step-down converter and an inductor to simplify design, reduce external components, and save PCB area. The compact design is excellent for automated assembly by standard surface mount equipment. Tight output voltage accuracy, even with small output capacitors, is achieved though the DCS-Control architecture and the excellent load transient performance. At medium-to-heavy loads, the converter operates in PWM mode and automatically enters power save mode operation at light load to maintain high efficiency over the entire load current range. The devices can also be forced in PWM mode operation for the smallest output voltage ripple. The I2C interface provides an effective way of adjusting the output voltage, setting the VOUT ramp rate when transitioning to a new setpoint or reading status information like thermal warning or current limit flags. An integrated soft start reduces the inrush current required from the input supply. Overtemperature protection and hiccup short-circuit protection deliver a robust and reliable design.

The TPSM8286xx device family consists of 4A and 6A step-down converter power modules designed for small design size and high efficiency. The power modules uses TI’s MagPack technology to integrate a synchronous step-down converter and an inductor to simplify design, reduce external components, and save PCB area. The compact design is excellent for automated assembly by standard surface mount equipment. Tight output voltage accuracy, even with small output capacitors, is achieved though the DCS-Control architecture and the excellent load transient performance. At medium-to-heavy loads, the converter operates in PWM mode and automatically enters power save mode operation at light load to maintain high efficiency over the entire load current range. The devices can also be forced in PWM mode operation for the smallest output voltage ripple. The I2C interface provides an effective way of adjusting the output voltage, setting the VOUT ramp rate when transitioning to a new setpoint or reading status information like thermal warning or current limit flags. An integrated soft start reduces the inrush current required from the input supply. Overtemperature protection and hiccup short-circuit protection deliver a robust and reliable design.

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Documentación técnica

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* Data sheet TPSM8286xx 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor and I2 C Interface in MagPack Package datasheet (Rev. A) PDF | HTML 06 nov 2024
Technical article MagPack technology: Four benefits of new power modules that can help you pack more power in less space PDF | HTML 09 jul 2024
Technical article Power module package types and their benefits PDF | HTML 09 jul 2024
EVM User's guide TPSM82866xxxPEVM MagPack™ Technology 6A Power Module Evaluation Module User's Guide PDF | HTML 20 jun 2024
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 06 dic 2023
Application note Intro to Multi-Function Pins and Their Applications in TI Step-Down Converters (Rev. A) PDF | HTML 17 nov 2022
Application note Quick Reference Guide To TI Buck Switching DC/DC Application Notes (Rev. B) PDF | HTML 23 may 2022
Application note Understanding SOA Curves to Operate at High Output Currents and Temperature PDF | HTML 05 may 2022
Functional safety information TPSM82866A and TPSM82864A Pin Failure Mode Analysis (Pin FMA) PDF | HTML 03 mar 2022
White paper Enabling Higher Data Rates for Optical Modules With Small and Efficient Power 22 mar 2021
White paper Benefits of a Resistor-to-Digital Converter in Ultra-Low Power Supplies 14 oct 2019
Analog Design Journal Methods of output-voltage adjustment for DC/DC converters 14 jun 2019
Application note Performing Accurate PFM Mode Efficiency Measurements (Rev. A) 11 dic 2018
Analog Design Journal Understanding 100% mode in low-power DC/DC converters 22 jun 2018
Analog Design Journal Achieving a clean startup by using a DC/DC converter with a precise enable-pin threshold 24 oct 2017
Analog Design Journal Improving the thermal performance of a MicroSiP(TM) power module 24 jul 2017
Analog Design Journal Testing tips for applying external power to supply outputs without an input voltage 24 oct 2016
Analog Design Journal Adjusting the soft-start time of an integrated power module 26 abr 2016
Analog Design Journal Understanding frequency variation in the DCS-Control(TM) topology 30 oct 2015
Analog Design Journal Five steps to a great PCB layout for a step-down converter 29 ene 2015
Analog Design Journal Accurately measuring efficiency of ultralow-IQ devices 22 ene 2014
Analog Design Journal High-efficiency, low-ripple DCS-Control offers seamless PWM/pwr-save transitions 25 jul 2013
Analog Design Journal Design considerations for a resistive feedback divider in a DC/DC converter 26 abr 2012
Application note Choosing an Appropriate Pull-up/Pull-down Resistor for Open Drain Outputs 19 sep 2011
Analog Design Journal IQ: What it is, what it isn’t, and how to use it 17 jun 2011

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TPSM82866CA3PEVM — Módulo de evaluación TPSM82866C

El módulo de evaluación (EVM) TPSM82866CA3PEVM facilita la evaluación del TPSM82866C, un módulo de alimentación reductora de 6 A compatible pin a pin en encapsulado MagPack™ de 2.3 mm × 3 mm × 1.95 mm. El EVM proporciona una tensión de salida ajustable I²C de 0.8 V con una precisión del 1 % para (...)
Guía del usuario: PDF | HTML
GUI para el módulo de evaluación (EVM)

TPSM8286XCEVM-GUI GUI for TPSM8286xC EVMs

The TPSM8286xCEVM-GUI interfaces with the TPSM8286xC EVMs via the USB2ANY adaptor to read and write to the device's I2C registers.
Productos y hardware compatibles

Productos y hardware compatibles

Productos
Módulos de alimentación (inductor integrado)
TPSM82866C Módulo de potencia reductor de 6 A y entrada de 5.5 V con inductor integrado e interfaz I2C en QF
Desarrollo de hardware
Placa de evaluación
TPSM82866CA3PEVM Módulo de evaluación TPSM82866C
Archivo Gerber

SR054A Gerber File

SLVC857.ZIP (2091 KB)
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
QFN-FCMOD (RCF) 15 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

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