TPS2HCS10-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C to 125°C
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- Withstands 35-V load dump
- Functional Safety-Compliant Development
- Documentation on safety mechanisms will be available at product release to aid ISO 26262 system design up to ASIL-B
- Dual-channel SPI controlled smart high-side switch with a typical 11-mΩ Rdson at 25°C FET
- Integrated wire-harness protection without MCU involvement and a SPI programmable fuse curve
- Protection against persistent overload condition
- Improve system level reliability through SPI programmable adjustable overcurrent protection
- Overcurrent protection threshold: 10 to 70 A
- SPI configurable capacitive charging mode to drive a wide range of capacitive input ECUs load current needs.
- Low quiescent current, low power ON-state to supply always-ON loads with automatic wake on load current increase with wake signal to MCU
- Robust integrated output protection:
- Integrated thermal protection
- Protection against short-to-ground
- Protection against reverse battery events including automatic switch on of FET with reverse supply voltage
- Automatic shut off on loss of battery and ground
- Integrated output clamp to demagnetize inductive loads
- Digital sense output via SPI can be configured to measure:
- Load current accurately with integrated ADC
- Output or supply voltage, FET temperature
- Provides full fault diagnostics through SPI interface and indication through FLT pin
- Detection of open load and short-to-battery
The TPS2HCS10-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI). The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection which is configurable via SPI in two ranges of thresholds. This allows sufficient flexibility to support loads that require large inrush currents, while providing improved protection. Further, the device integrates a programmable fuse profile (current versus time) that turns off the switch under persistent overload condition, thereby reducing the overhead on the MCU. These two features together allow optimization of the wire harness for any load profile with full protection.
The device supports a SPI-configurable capacitive charging mode for ECU loads in power distribution switch applications. The device also includes a low quiescent current ON-state that provides up to 800 mA of peak current while consuming about 10 µA of current.
The TPS2HCS10-Q1 device also provides a high accuracy digital current sense over SPI that allows for improved load diagnostics. By reporting load current and the channel output voltage and output FET temperature to a system MCU, the device enables diagnosis of switch and load failures.
The TPS2HCS10-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.
기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
HSS-2HCS10EVM — 스마트 퓨즈 고압측 스위치용 TPS2HCS10-Q1 부속 카드
HSS-2HCS10EVM은 HSS-HCMOTHERBRDEVM과 함께 사용하도록 설계된 부속 카드입니다. 이 부속 카드는 텍사스 인스트루먼트의 스마트 퓨즈 포트폴리오의 기능을 보여줍니다.
HSS-HCMOTHERBRDEVM — Smart fuse evaluation module
The HSS-HCMOTHERBRDEVM and corresponding daughter cards (such as the HSS-2HCS10EVM) are used to showcase and evaluate all features of the Texas Instruments' smart fuse high-side switch portfolio. The motherboard is designed to be used with several different daughter cards enabling the use of a (...)
HSS-HCS-BLANKEVM — 스마트 퓨즈 스위치 포트폴리오를 위한 채워지지 않은 평가 모듈
HSS-SMART-CONFIGURATOR — Configuration tool for the HSS-HCMOTHERBRDEVM and TI's smart fuse high-side switches
지원되는 제품 및 하드웨어
제품
고압측 스위치
하드웨어 개발
평가 보드
HCS-HEADER-FILES — C Header files for smart fuse high-side switches with register definitions
지원되는 제품 및 하드웨어
제품
고압측 스위치
하드웨어 개발
평가 보드
도터 카드
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TIDA-020079 — 구역 레퍼런스 설계
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
HTSSOP (PWP) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.