Inicio Interfaz Otras interfaces

DS32EL0124

ACTIVO

Deserializador FPGA-link de 125 MHz a 312.5 MHz con interfaz paralela LVDS DDR

Detalles del producto

Protocols Catalog Rating Catalog Operating temperature range (°C) -40 to 85
Protocols Catalog Rating Catalog Operating temperature range (°C) -40 to 85
WQFN (RHS) 48 49 mm² 7 x 7
  • 5-bit DDR LVDS Parallel Data Interface
  • Programmable Receive Equalization
  • Selectable DC-Balance Decoder
  • Selectable De-Scrambler
  • Remote Sense for Automatic Detection and Negotiation of Link Status
  • No External Receiver Reference Clock Required
  • LVDS Parallel Interface
  • Programmable LVDS Output Clock Delay
  • Supports Output Data-Valid Signaling
  • Supports Keep-Alive Clock Output
  • On Chip LC VCOs
  • Redundant Serial Input (ELX device only)
  • Retimed Serial Output (ELX device only)
  • Configurable PLL Loop Bandwidth
  • Configurable via SMBus
  • Loss of Lock and Error Reporting
  • 48-pin WQFN Package with Exposed DAP

Key Specifications

  • 1.25 to 3.125 Gbps Serial Data Rate
  • 125 to 312.5 MHz DDR Parallel Clock
  • -40° to +85°C Temperature Range
  • > 8 kV ESD (HBM) Protection
  • 0.5 UI Minimum Input Jitter Tolerance (1.25 Gbps)

All trademarks are the property of their respective owners.

  • 5-bit DDR LVDS Parallel Data Interface
  • Programmable Receive Equalization
  • Selectable DC-Balance Decoder
  • Selectable De-Scrambler
  • Remote Sense for Automatic Detection and Negotiation of Link Status
  • No External Receiver Reference Clock Required
  • LVDS Parallel Interface
  • Programmable LVDS Output Clock Delay
  • Supports Output Data-Valid Signaling
  • Supports Keep-Alive Clock Output
  • On Chip LC VCOs
  • Redundant Serial Input (ELX device only)
  • Retimed Serial Output (ELX device only)
  • Configurable PLL Loop Bandwidth
  • Configurable via SMBus
  • Loss of Lock and Error Reporting
  • 48-pin WQFN Package with Exposed DAP

Key Specifications

  • 1.25 to 3.125 Gbps Serial Data Rate
  • 125 to 312.5 MHz DDR Parallel Clock
  • -40° to +85°C Temperature Range
  • > 8 kV ESD (HBM) Protection
  • 0.5 UI Minimum Input Jitter Tolerance (1.25 Gbps)

All trademarks are the property of their respective owners.

The DS32EL0124/DS32ELX0124 integrates clock and data recovery modules for high-speed serial communication over FR-4 printed circuit board backplanes, balanced cables, and optical fiber. This easy-to-use chipset integrates advanced signal and clock conditioning functions, with an FPGA friendly interface.

The DS32EL0124/DS32ELX0124 deserializes up to 3.125 Gbps of high speed serial data to 5 LVDS outputs without the need for an external reference clock. With DC-balance decoding enabled, the application payload of 2.5 Gbps is deserialized to 4 LVDS outputs.

The DS32EL0124/DS32ELX01214 deserializers feature a remote sense capability to automatically signal link status conditions to its companion DS32EL0421/ELX0421 serializers without requiring an additional feedback path.

The parallel LVDS interface of these devices reduce FPGA I/O pins, board trace count and alleviates EMI issues, when compared to traditional single-ended wide bus interfaces.

The DS32EL0124/ELX0124 is programmable through a SMBus interface as well as through control pins.

The DS32EL0124/DS32ELX0124 integrates clock and data recovery modules for high-speed serial communication over FR-4 printed circuit board backplanes, balanced cables, and optical fiber. This easy-to-use chipset integrates advanced signal and clock conditioning functions, with an FPGA friendly interface.

The DS32EL0124/DS32ELX0124 deserializes up to 3.125 Gbps of high speed serial data to 5 LVDS outputs without the need for an external reference clock. With DC-balance decoding enabled, the application payload of 2.5 Gbps is deserialized to 4 LVDS outputs.

The DS32EL0124/DS32ELX01214 deserializers feature a remote sense capability to automatically signal link status conditions to its companion DS32EL0421/ELX0421 serializers without requiring an additional feedback path.

The parallel LVDS interface of these devices reduce FPGA I/O pins, board trace count and alleviates EMI issues, when compared to traditional single-ended wide bus interfaces.

The DS32EL0124/ELX0124 is programmable through a SMBus interface as well as through control pins.

Descargar Ver vídeo con transcripción Video

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 3
Tipo Título Fecha
* Data sheet DS32EL0124/ELX0124 125MHz-312.5MHz FPGA-Link Deserializr w/DDR LVDS Para I/F datasheet (Rev. K) 15 abr 2013
Application note Expanding the Payload w/FPGA-Link DS32ELX0421 and DS32ELX0124 SER/DES (Rev. A) 26 abr 2013
Application note LVDS Timing DS32ELX0421 and DS32ELX0124 Serializers and Deserializers (Rev. A) 26 abr 2013

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

DS32ELX0124 IBIS Model

SNLM199.ZIP (56 KB) - IBIS Model
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
WQFN (RHS) 48 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos