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DS90CP22

ACTIVO

Interruptor de conexión cruzada LVDS de 2x2 de 800 Mbps

Detalles del producto

Function Crosspoint Protocols LVDS, LVPECL Number of transmitters 2 Number of receivers 2 Supply voltage (V) 3.3 Signaling rate (Mbps) 800 Input signal CML, LVDS, LVPECL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
Function Crosspoint Protocols LVDS, LVPECL Number of transmitters 2 Number of receivers 2 Supply voltage (V) 3.3 Signaling rate (Mbps) 800 Input signal CML, LVDS, LVPECL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (D) 16 59.4 mm² 9.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4
  • DC - 800 Mbps Low Jitter, Low Skew Operation
  • 65 ps (typ) of Pk-Pk Jitter with PRBS = 223−1 Data Pattern at 800 Mbps
  • Single +3.3 V Supply
  • Less than 330 mW (typ) Total Power Dissipation
  • Non-Blocking "'Switch Architecture"'
  • Balanced Output Impedance
  • Output Channel-to-Channel Skew is 35 ps (typ)
  • Configurable as 2:1 mux, 1:2 demux, Repeater or 1:2 Signal Splitter
  • LVDS Receiver Inputs Accept LVPECL Signals
  • Fast Switch Time of 1.2ns (typ)
  • Fast Propagation Delay of 1.3ns (typ)
  • Receiver Input Threshold < ±100 mV
  • Available in 16 Lead TSSOP and SOIC Packages
  • Conforms to ANSI/TIA/EIA-644-1995 LVDS Standard
  • Operating Temperature: −40°C to +85°C

All trademarks are the property of their respective owners.

  • DC - 800 Mbps Low Jitter, Low Skew Operation
  • 65 ps (typ) of Pk-Pk Jitter with PRBS = 223−1 Data Pattern at 800 Mbps
  • Single +3.3 V Supply
  • Less than 330 mW (typ) Total Power Dissipation
  • Non-Blocking "'Switch Architecture"'
  • Balanced Output Impedance
  • Output Channel-to-Channel Skew is 35 ps (typ)
  • Configurable as 2:1 mux, 1:2 demux, Repeater or 1:2 Signal Splitter
  • LVDS Receiver Inputs Accept LVPECL Signals
  • Fast Switch Time of 1.2ns (typ)
  • Fast Propagation Delay of 1.3ns (typ)
  • Receiver Input Threshold < ±100 mV
  • Available in 16 Lead TSSOP and SOIC Packages
  • Conforms to ANSI/TIA/EIA-644-1995 LVDS Standard
  • Operating Temperature: −40°C to +85°C

All trademarks are the property of their respective owners.

DS90CP22 is a 2x2 crosspoint switch utilizing LVDS (Low Voltage Differential Signaling) technology for low power, high speed operation. Data paths are fully differential from input to output for low noise generation and low pulse width distortion. The non-blocking design allows connection of any input to any output or outputs. LVDS I/O enable high speed data transmission for point-to-point interconnects. This device can be used as a high speed differential crosspoint, 2:1 mux, 1:2 demux, repeater or 1:2 signal splitter. The mux and demux functions are useful for switching between primary and backup circuits in fault tolerant systems. The 1:2 signal splitter and 2:1 mux functions are useful for distribution of serial bus across several rack-mounted backplanes.

The DS90CP22 accepts LVDS signal levels, LVPECL levels directly or PECL with attenuation networks.

The individual LVDS outputs can be put into TRI-STATE by use of the enable pins.

For more details, please refer to the section of this datasheet.

DS90CP22 is a 2x2 crosspoint switch utilizing LVDS (Low Voltage Differential Signaling) technology for low power, high speed operation. Data paths are fully differential from input to output for low noise generation and low pulse width distortion. The non-blocking design allows connection of any input to any output or outputs. LVDS I/O enable high speed data transmission for point-to-point interconnects. This device can be used as a high speed differential crosspoint, 2:1 mux, 1:2 demux, repeater or 1:2 signal splitter. The mux and demux functions are useful for switching between primary and backup circuits in fault tolerant systems. The 1:2 signal splitter and 2:1 mux functions are useful for distribution of serial bus across several rack-mounted backplanes.

The DS90CP22 accepts LVDS signal levels, LVPECL levels directly or PECL with attenuation networks.

The individual LVDS outputs can be put into TRI-STATE by use of the enable pins.

For more details, please refer to the section of this datasheet.

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Documentación técnica

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Ver todo 4
Tipo Título Fecha
* Data sheet DS90CP22 800 Mbps 2x2 LVDS Crosspoint Switch datasheet (Rev. E) 22 abr 2013
White paper LVDS, CML, ECL-differential interfaces with odd voltages 01 may 2003
White paper Digital Microphones - Applications and System Partitioning 01 abr 2003
White paper Making the Most of Your LVDS - 5 Tips for Buffering Signal Integrity Headaches 01 ago 2001

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

DS90CP22 IBIS Model

SNLM054.ZIP (29 KB) - IBIS Model
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOIC (D) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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