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LM2502

ACTIVO

Serializador y deserializador de interfaz de pantalla Mobile Pixel Link (MPL)

Detalles del producto

Protocols Catalog Rating Catalog Operating temperature range (°C) -30 to 85
Protocols Catalog Rating Catalog Operating temperature range (°C) -30 to 85
WQFN (RSB) 40 25 mm² 5 x 5
  • >300 Mbps Dual Link Raw Throughput
  • MPL Physical Layer (MPL-0)
  • Pin Selectable Master / Slave Mode
  • Frequency Reference Transport
  • Complete LVCMOS / MPL Translation
  • Interface Modes:
    • 16-bit CPU, i80 or m68 Style
    • RGB565 with Glue Logic
  • −30°C to 85°C Operating Range
  • Link Power Down Mode Reduces IDDZ < 10 µA
  • Dual Display Support (CS1* & CS2*)
  • Via-less MPL Interconnect Feature
  • 3.0V Supply Voltage (VDD and VDDA)
  • Interfaces to 1.7V to 3.3V Logic (VDDIO)

All trademarks are the property of their respective owners.

  • >300 Mbps Dual Link Raw Throughput
  • MPL Physical Layer (MPL-0)
  • Pin Selectable Master / Slave Mode
  • Frequency Reference Transport
  • Complete LVCMOS / MPL Translation
  • Interface Modes:
    • 16-bit CPU, i80 or m68 Style
    • RGB565 with Glue Logic
  • −30°C to 85°C Operating Range
  • Link Power Down Mode Reduces IDDZ < 10 µA
  • Dual Display Support (CS1* & CS2*)
  • Via-less MPL Interconnect Feature
  • 3.0V Supply Voltage (VDD and VDDA)
  • Interfaces to 1.7V to 3.3V Logic (VDDIO)

All trademarks are the property of their respective owners.

The LM2502 device is a dual link display interface SERDES that adapts existing CPU / video busses to a low power current-mode serial MPL link. The chipset may also be used for a RGB565 application with glue logic. The interconnect is reduced from 22 signals to only 3 active signals with the LM2502 chipset easing flex interconnect design, size and cost.

The Master Serializer (SER) resides beside an application processor or baseband processor and translates a parallel bus from LVCMOS levels to serial MPL levels for transmission over a flex cable and PCB traces to the Slave Deserializer (DES) located near the display module.

Dual display support is provided for a primary and sub display through the use of two ChipSelect signals. A Mode pin selects either a i80 or m68 style interface.

The Power_Down (PD*) input controls the power state of the MPL interface. When PD* is asserted, the MD1/0 and MC signals are powered down to save current.

The LM2502 implements the physical layer of the MPL Standard (MPL-0). The LM2502 is offered in NOPB (Lead-free) NFBGA and WQFN packages.

The LM2502 device is a dual link display interface SERDES that adapts existing CPU / video busses to a low power current-mode serial MPL link. The chipset may also be used for a RGB565 application with glue logic. The interconnect is reduced from 22 signals to only 3 active signals with the LM2502 chipset easing flex interconnect design, size and cost.

The Master Serializer (SER) resides beside an application processor or baseband processor and translates a parallel bus from LVCMOS levels to serial MPL levels for transmission over a flex cable and PCB traces to the Slave Deserializer (DES) located near the display module.

Dual display support is provided for a primary and sub display through the use of two ChipSelect signals. A Mode pin selects either a i80 or m68 style interface.

The Power_Down (PD*) input controls the power state of the MPL interface. When PD* is asserted, the MD1/0 and MC signals are powered down to save current.

The LM2502 implements the physical layer of the MPL Standard (MPL-0). The LM2502 is offered in NOPB (Lead-free) NFBGA and WQFN packages.

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Documentación técnica

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Tipo Título Fecha
* Data sheet LM2502 Mobile Pixel Link (MPL) Display Interface Serializer and Deserializer datasheet (Rev. L) 02 may 2013
Application note Mobile Pixel Link Level-0 20 mar 2012

Diseño y desarrollo

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Herramienta de simulación

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WQFN (RSB) 40 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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