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Circuitos integrados LVDS, M-LVDS y PECL

SN65LVDM180

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Transceptor LVDM de dúplex completo

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SN65LVDM180

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Detalles del producto

Function Transceiver Protocols LVDM, LVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (Mbps) 100 Input signal LVDM, LVDS, LVTTL Output signal LVDM, LVDS, LVTTL Rating Catalog Operating temperature range (°C) -40 to 85
Function Transceiver Protocols LVDM, LVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (Mbps) 100 Input signal LVDM, LVDS, LVTTL Output signal LVDM, LVDS, LVTTL Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (D) 14 51.9 mm² 8.65 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4
  • Low-Voltage Differential 50- Line Drivers and Receivers
  • Typical Full-Duplex Signaling Rates of 100 Mbps
  • Bus-Terminal ESD Exceeds 12 kV
  • Operates From a Single 3.3-V Supply
  • Low-Voltage Differential Signaling With Typical
    Output Voltages of 340 mV With a 50- Load
  • Valid Output With as Little as 50-mV Input
    Voltage Difference
  • Propagation Delay Times
    • Driver: 1.7 ns Typical
    • Receiver: 3.7 ns Typical
  • Power Dissipation at 200 MHz
    • Driver: 50 mW Typical
    • Receiver: 60 mW Typical
  • LVTTL Input Levels Are 5-V Tolerant
  • Driver Is High Impedance When Disabled or With VCC < 1.5 V
  • Receiver Has Open-Circuit Failsafe
  • Low-Voltage Differential 50- Line Drivers and Receivers
  • Typical Full-Duplex Signaling Rates of 100 Mbps
  • Bus-Terminal ESD Exceeds 12 kV
  • Operates From a Single 3.3-V Supply
  • Low-Voltage Differential Signaling With Typical
    Output Voltages of 340 mV With a 50- Load
  • Valid Output With as Little as 50-mV Input
    Voltage Difference
  • Propagation Delay Times
    • Driver: 1.7 ns Typical
    • Receiver: 3.7 ns Typical
  • Power Dissipation at 200 MHz
    • Driver: 50 mW Typical
    • Receiver: 60 mW Typical
  • LVTTL Input Levels Are 5-V Tolerant
  • Driver Is High Impedance When Disabled or With VCC < 1.5 V
  • Receiver Has Open-Circuit Failsafe

The SN65LVDM179, SN65LVDM180, SN65LVDM050, and SN65LVDM051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve high signaling rates. These circuits are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts, except that the output current of the drivers is doubled. This modification provides a minimum differential output voltage magnitude of 247 mV across a 50- load simulating two transmission lines in parallel. This allows having data buses with more than one driver or with two line termination resistors. The receivers detect a voltage difference of 50 mV with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of these devices and signaling techniques is point-to-point half duplex, baseband data transmission over a controlled impedance media of approximately 100 characteristic impedance.

The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other application-specific characteristics.

The SN65LVDM179, SN65LVDM180, SN65LVDM050, and SN65LVDM051 are characterized for operation from –40°C to 85°C.

The SN65LVDM179, SN65LVDM180, SN65LVDM050, and SN65LVDM051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve high signaling rates. These circuits are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts, except that the output current of the drivers is doubled. This modification provides a minimum differential output voltage magnitude of 247 mV across a 50- load simulating two transmission lines in parallel. This allows having data buses with more than one driver or with two line termination resistors. The receivers detect a voltage difference of 50 mV with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of these devices and signaling techniques is point-to-point half duplex, baseband data transmission over a controlled impedance media of approximately 100 characteristic impedance.

The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other application-specific characteristics.

The SN65LVDM179, SN65LVDM180, SN65LVDM050, and SN65LVDM051 are characterized for operation from –40°C to 85°C.
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Documentación técnica

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Tipo Título Fecha
* Data sheet High-Speed Differential Line Drivers And Receivers datasheet (Rev. J) 17 jul 2009
Application note An Introduction to M-LVDS and Clock and Data Distribution Applications (Rev. C) PDF | HTML 22 jun 2023
Application brief How Far, How Fast Can You Operate MLVDS? 06 ago 2018
Application note SPI-Based Data Acquisition/Monitor Using the TLC2551 Serial ADC (Rev. A) 20 nov 2001

Diseño y desarrollo

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Modelo de simulación

SN65LVDM180 IBIS Model

SLLM013.ZIP (50 KB) - IBIS Model
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Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
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SOIC (D) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian
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Pedidos y calidad

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  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
  • Lugar de ensamblaje

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