Inicio Interfaz Otras interfaces

TSB12LV26-EP

ACTIVO

Controlador host IEEE 1394 basado en PCI OHCI-Lynx, producto mejorado

Detalles del producto

Protocols HiRel Enhanced Product Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 105
Protocols HiRel Enhanced Product Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 105
LQFP (PZ) 100 256 mm² 16 x 16
  • Controlled Baseline
  • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 110°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • 3.3-V and 5-V PCI bus signaling
  • 3.3-V supply (core voltage is internally regulated to 1.8 V)
  • Serial bus data rates of 100M bits/s, 200M bits/s, and 400M bits/s
  • Physical write posting of up to three outstanding transactions
  • Serial ROM interface supports 2-wire devices
  • External cycle timer control for customized synchronization
  • PCI burst transfers and deep FIFOs to tolerate large host latency
  • Two general-purpose I/Os
  • Fabricated in advanced low-power CMOS process
  • Packaged in 100-terminal LQFP (PZ)
  • PCI_CLKRUN\ protocol

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
OHCI-Lynx and TI are trademarks of Texas Instruments.
Other trademarks are the property of their respective owners.

  • Controlled Baseline
  • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 110°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • 3.3-V and 5-V PCI bus signaling
  • 3.3-V supply (core voltage is internally regulated to 1.8 V)
  • Serial bus data rates of 100M bits/s, 200M bits/s, and 400M bits/s
  • Physical write posting of up to three outstanding transactions
  • Serial ROM interface supports 2-wire devices
  • External cycle timer control for customized synchronization
  • PCI burst transfers and deep FIFOs to tolerate large host latency
  • Two general-purpose I/Os
  • Fabricated in advanced low-power CMOS process
  • Packaged in 100-terminal LQFP (PZ)
  • PCI_CLKRUN\ protocol

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
OHCI-Lynx and TI are trademarks of Texas Instruments.
Other trademarks are the property of their respective owners.

The Texas Instruments TSB12LV26 device is a PCI-to-1394 host controller compliant with the PCI Local Bus Specification, PCI Bus Power Management Interface Specification, IEEE Std 1394-1995, and 1394 Open Host Controller Interface Specification. The chip provides the IEEE 1394 link function and is compatible with 100M bits/s, 200M bits/s, and 400M bits/s serial bus data rates.

As required by the 1394 Open Host Controller Interface Specification (OHCI) and IEEE Std 1394a-2000, internal control registers are memory-mapped and nonprefetchable. The PCI configuration header is accessed through configuration cycles specified by PCI and provides plug-and-play (PnP) compatibility. Furthermore, the TSB12LV26 device is compliant with the PCI Bus Power Management Interface Specification, per the PC 99 Design Guide requirements. TSB12LV26 device supports the D0, D2, and D3 power states.

The TSB12LV26 design provides PCI bus master bursting and is capable of transferring a cacheline of data at 132M bytes/s after connection to the memory controller. Since PCI latency can be large, deep FIFOs are provided to buffer 1394 data.

The TSB12LV26 device provides physical write posting buffers and a highly-tuned physical data path for SBP-2 performance. The TSB12LV26 device also provides multiple isochronous contexts, multiple cacheline burst transfers, advanced internal arbitration, and bus-holding buffers on the PHY/link interface.

An advanced CMOS process achieves low power consumption and allows the TSB12LV26 device to operate at PCI clock rates up to 33 MHz.

The Texas Instruments TSB12LV26 device is a PCI-to-1394 host controller compliant with the PCI Local Bus Specification, PCI Bus Power Management Interface Specification, IEEE Std 1394-1995, and 1394 Open Host Controller Interface Specification. The chip provides the IEEE 1394 link function and is compatible with 100M bits/s, 200M bits/s, and 400M bits/s serial bus data rates.

As required by the 1394 Open Host Controller Interface Specification (OHCI) and IEEE Std 1394a-2000, internal control registers are memory-mapped and nonprefetchable. The PCI configuration header is accessed through configuration cycles specified by PCI and provides plug-and-play (PnP) compatibility. Furthermore, the TSB12LV26 device is compliant with the PCI Bus Power Management Interface Specification, per the PC 99 Design Guide requirements. TSB12LV26 device supports the D0, D2, and D3 power states.

The TSB12LV26 design provides PCI bus master bursting and is capable of transferring a cacheline of data at 132M bytes/s after connection to the memory controller. Since PCI latency can be large, deep FIFOs are provided to buffer 1394 data.

The TSB12LV26 device provides physical write posting buffers and a highly-tuned physical data path for SBP-2 performance. The TSB12LV26 device also provides multiple isochronous contexts, multiple cacheline burst transfers, advanced internal arbitration, and bus-holding buffers on the PHY/link interface.

An advanced CMOS process achieves low power consumption and allows the TSB12LV26 device to operate at PCI clock rates up to 33 MHz.

Descargar Ver vídeo con transcripción Video

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 3
Tipo Título Fecha
* Data sheet TSB12LV26-EP: OHCI-Lynx PCI-Based IEEE 1394 Host Controller datasheet (Rev. B) 24 nov 2004
* VID TSB12LV26-EP VID V6203627 21 jun 2016
Application note Interfacing Between the 1394a Links and TSB41BA3A (Rev. A) 04 oct 2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
LQFP (PZ) 100 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos