UCC27525
- Industry-standard pinout
- Two independent gate-drive channels
- 5A peak source and sink-drive current
- Independent-enable function for each output
- TTL and CMOS compatible logic threshold independent of supply voltage
- Hysteretic-logic thresholds for high noise immunity
- Inputs and enable pin-voltage levels not restricted by VDD pin bias supply voltage
- 4.5V to 18V single-supply range
- Outputs held low during VDD-UVLO, (ensures glitch-free operation at power up and power down)
- Fast propagation delays (13ns typical)
- Fast rise and fall times (7ns and 6ns typical)
- 1ns typical delay matching between two channels
- Two outputs are in parallel for higher drive current
- Outputs held low when inputs floating
- PDIP (8), SOIC (8), MSOP (8) PowerPAD™ and 3mm × 3mm WSON-8 package options
- Operating temperature range of –40°C to 140°C
The UCC2752x family of devices are dual-channel, high-speed, low-side gate-driver devices capable of effectively driving MOSFET and IGBT power switches. Using a design that inherently minimizes shoot-through current, UCC2752x can deliver high-peak current pulses of up to 5A source and 5A sink into capacitive loads along with rail-to-rail drive capability and extremely small propagation delay (typically 13ns). In addition, the drivers feature matched internal propagation delays between the two channels. These delays are very well suited for applications requiring dual-gate drives with critical timing, such as synchronous rectifiers. This also enables connecting two channels in parallel to effectively increase current-drive capability or driving two switches in parallel with one input signal. The input pin thresholds are based on TTL and CMOS compatible low-voltage logic, which is fixed and independent of the VDD supply voltage. Wide hysteresis between the high and low thresholds offers excellent noise immunity.
The UCC2752x family provides the combination of three standard logic options — dual inverting, dual noninverting, one inverting and one noninverting driver. The UCC27526 features a dual input design which offers flexibility of both inverting (IN– pin) and non-inverting (IN+ pin) configuration for each channel. Either IN+ or IN– pin controls the state of the driver output. The unused input pin is used for enable and disable functions. For safety purpose, internal pullup and pulldown resistors on the input pins of all the devices in UCC2752x family ensure that outputs are held LOW when input pins are in floating condition. The UCC27523 and UCC27525 devices feature Enable pins (ENA and ENB) to have better control of the operation of the driver applications. The pins are internally pulled up to VDD for active-high logic and are left open for standard operation.
The UCC2752x family of devices are available in SOIC-8 (D), MSOP-8 with exposed pad (DGN) and 3mm × 3mm WSON-8 with exposed pad (DSD) packages. The UCC27526 is only offered in a 3mm × 3mm WSON (DSD) package.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | UCC2752x Dual 5A High-Speed, Low-Side Gate Drivers datasheet (Rev. H) | PDF | HTML | 2024年 6月 14日 |
Application note | Why use a Gate Drive Transformer? | PDF | HTML | 2024年 3月 4日 | |
Application brief | External Gate Resistor Selection Guide (Rev. A) | 2020年 2月 28日 | ||
Application brief | Understanding Peak IOH and IOL Currents (Rev. A) | 2020年 2月 28日 | ||
Application note | Improving Efficiency of DC-DC Conversion through Layout | 2019年 5月 7日 | ||
More literature | Fundamentals of MOSFET and IGBT Gate Driver Circuits (Replaces SLUP169) (Rev. A) | 2018年 10月 29日 | ||
Selection guide | Power Management Guide 2018 (Rev. R) | 2018年 6月 25日 | ||
Application brief | Low-Side Gate Drivers With UVLO Versus BJT Totem-Pole | 2018年 3月 16日 |
設計與開發
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UCC27423-4-5-Q1EVM — 具有啟用功能的 UCC2742xQ1 雙路 4A 高速低壓側 MOSFET 驅動器評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TIDM-02010 — 用於暖通空調的數位交錯式 PFC 雙馬達控制參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HVSSOP (DGN) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
WSON (DSD) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。