Información de empaque
| Encapsulado | Pines SOIC (D) | 8 |
| Rango de temperatura de funcionamiento (℃) -40 to 85 |
| Cant. de paquetes | Empresa de transporte 2,500 | LARGE T&R |
Características para DS90LV027A
- >600-Mbps (300 MHz) Switching Rates
- 0.3-ns Typical Differential Skew
- 0.7-ns Maximum Differential Skew
- 1.5-ns Maximum Propagation Delay
- 3.3-V Power Supply Design
- ±360-mV Differential Signaling
- Low Power Dissipation (46 mW at 3.3-V Static)
- Flow-Through Design Simplifies PCB Layout
- Interoperable With Existing 5-V LVDS Devices
- Power-Off Protection (Outputs in High Impedance)
- Conforms to TIA/EIA-644 Standard
- 8-Pin SOIC Package Saves Space
- Industrial Temperature Operating Range:
–40°C to 85°C
Descripción de DS90LV027A
The DS90LV027A is a dual LVDS driver device optimized for high data rate and low-power applications. The device is designed to support data rates in excess of 600 Mbps (300 MHz) using Low Voltage Differential Signaling (LVDS) technology. The DS90LV027A is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized.
The device is in a 8-pin SOIC package. The DS90LV027A has a flow-through design for easy printed-circuit board (PCB) layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high-speed transfer of clock and data. The DS90LV027A can be paired with its companion dual line receiver, the DS90LV028A, or with any of TI’s LVDS receivers, to provide a high-speed point-to-point LVDS interface.