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LM8335

ACTIVO

Expansor de salida de uso general con interfaz de host MIPI RFFE

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LM8335

ACTIVO
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Detalles del producto

Number of I/Os 8 Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Addresses 2 Rating Catalog Frequency (max) (MHz) 26 Operating temperature range (°C) -30 to 85
Number of I/Os 8 Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Addresses 2 Rating Catalog Frequency (max) (MHz) 26 Operating temperature range (°C) -30 to 85
DSBGA (YZR) 16 5.0625 mm² 2.25 x 2.25
  • MIPI RFFE Interface Version 1.10 Compliant
  • Supports Output Expansion
  • Host Interface Address Select Pin:
    • ADR=GND, USID[3:0]=0001
    • ADR=VDD, USID[3:0]=1001
  • Pin-Configurable Initial State: VIO
    • CFG=GND, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Unmasked
    • CFG=VDD, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Masked
  • Three Sources for Chip Reset:
    • VIO Input Pin
    • POR
    • Software-Commanded Reset

Key Specifications

  • 1.8 ± 0.15V MIPI RFFE Operation (VIO)
  • 1.8 ± 0.15V Core Supply (VDD)
  • 1.65 to 3.6V GPO Supply (VDDIO)
  • Low Standby and Active Current
  • On-Chip Power-On Reset (POR)
  • −30 to +85°C Ambient Temperature Range
  • 16-Bump DSBGA Package
    • 1.965 mm x 1.965 mm x 0.6 mm, 0.5 mm Pitch (Nominal)

All trademarks are the property of their respective owners.

  • MIPI RFFE Interface Version 1.10 Compliant
  • Supports Output Expansion
  • Host Interface Address Select Pin:
    • ADR=GND, USID[3:0]=0001
    • ADR=VDD, USID[3:0]=1001
  • Pin-Configurable Initial State: VIO
    • CFG=GND, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Unmasked
    • CFG=VDD, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Masked
  • Three Sources for Chip Reset:
    • VIO Input Pin
    • POR
    • Software-Commanded Reset

Key Specifications

  • 1.8 ± 0.15V MIPI RFFE Operation (VIO)
  • 1.8 ± 0.15V Core Supply (VDD)
  • 1.65 to 3.6V GPO Supply (VDDIO)
  • Low Standby and Active Current
  • On-Chip Power-On Reset (POR)
  • −30 to +85°C Ambient Temperature Range
  • 16-Bump DSBGA Package
    • 1.965 mm x 1.965 mm x 0.6 mm, 0.5 mm Pitch (Nominal)

All trademarks are the property of their respective owners.

The LM8335 General Purpose Output Expander is a dedicated device to provide flexible and general purpose, host programmable output expansion functions. This device communicates with a host processor through a MIPI® RFFE Interface (Mobile Industry Processor Interface RF Front-End).

Eight general purpose outputs (GPO) can be configured by the host controller as drive high/low/high-z. Weak pull-ups (PU) or weak pull-downs (PD) can be enabled.

Upon power-on, the LM8335 default configuration is for all GPO to be set based on the state of the CFG pin.

After startup, any changes to the default configuration must be sent from the host via the MIPI RFFE host interface..

The LM8335 is available in a 16-bump lead-free DSBGA package of size 1.965 mm x 1.965 mm x 0.6 mm (0.5 mm pitch).

The LM8335 General Purpose Output Expander is a dedicated device to provide flexible and general purpose, host programmable output expansion functions. This device communicates with a host processor through a MIPI® RFFE Interface (Mobile Industry Processor Interface RF Front-End).

Eight general purpose outputs (GPO) can be configured by the host controller as drive high/low/high-z. Weak pull-ups (PU) or weak pull-downs (PD) can be enabled.

Upon power-on, the LM8335 default configuration is for all GPO to be set based on the state of the CFG pin.

After startup, any changes to the default configuration must be sent from the host via the MIPI RFFE host interface..

The LM8335 is available in a 16-bump lead-free DSBGA package of size 1.965 mm x 1.965 mm x 0.6 mm (0.5 mm pitch).
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Documentación técnica

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* Data sheet LM8335 General-Purpose Output Expander with MIPI RFFE Host Interface datasheet (Rev. B) 02 may 2013

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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