SM74611
- Maximum Reverse Voltage (VR) of 30 V
- Operating Forward Current (IF) of up to 15 A
- Low Average Forward Voltage (26 mV at 8 A)
- Less Power Dissipation than Schottky Diode
- Lower Leakage Current than Schottky Diode
- Footprint and Pin-Compatible With Conventional
D2PAK Schottky Diode - Operating Range (TJ) of –40°C to 125°C
The SM74611 device is a smart bypass diode used in photovoltaic applications. The SM74611 device serves the purpose of providing an alternate path for string current when parts of the panel are shaded during normal operation. Without bypass diodes, the shaded cells will exhibit a hot spot which is caused by excessive power dissipation in the reverse biased cells.
Currently, conventional P-N junction diodes or Schottky diodes are used to mitigate this issue. Unfortunately the forward voltage drop for these diodes is still considered high (approximately 0.6 V for normal diodes and 0.4 V for Schottky). With 10 A of currents flowing through these diodes, the power dissipation can reach as high as 6 W. This in turn will raise the temperature inside the junction box where these diodes normally reside and reduce module reliability.
The advantage of the SM74611 is that it has a lower forward voltage drop than P-N junction and Schottky diodes. It has a typical average forward voltage drop of 26 mV at 8 A of current. This translates into typical power dissipation of 208 mW, which is significantly lower than the 3.2 W of conventional Schottky diodes. The SM74611 is also footprint and pin compatible with conventional D2PAK Schottky diodes, making it a drop-in replacement in many applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SM74611 Smart Bypass Diode datasheet (Rev. B) | PDF | HTML | 2016年 5月 27日 |
Application note | Basics of Ideal Diodes (Rev. B) | PDF | HTML | 2021年 10月 5日 | |
E-book | 11 Ways to Protect Your Power Path | 2019年 7月 3日 |
設計與開發
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SM74611 Unencrypted PSpice Transient Model Package (Rev. A)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PMP10171 — 四通道 LED 聚光燈驅動器參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TO-263 (KTT) | 3 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。