TPS2HCS10-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C to 125°C
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- Withstands 35-V load dump
- Functional Safety-Compliant Development
- Documentation on safety mechanisms will be available at product release to aid ISO 26262 system design up to ASIL-B
- Dual-channel SPI controlled smart high-side switch with a typical 11-mΩ Rdson at 25°C FET
- Integrated wire-harness protection without MCU involvement and a SPI programmable fuse curve
- Protection against persistent overload condition
- Improve system level reliability through SPI programmable adjustable overcurrent protection
- Overcurrent protection threshold: 10 to 70 A
- SPI configurable capacitive charging mode to drive a wide range of capacitive input ECUs load current needs.
- Low quiescent current, low power ON-state to supply always-ON loads with automatic wake on load current increase with wake signal to MCU
- Robust integrated output protection:
- Integrated thermal protection
- Protection against short-to-ground
- Protection against reverse battery events including automatic switch on of FET with reverse supply voltage
- Automatic shut off on loss of battery and ground
- Integrated output clamp to demagnetize inductive loads
- Digital sense output via SPI can be configured to measure:
- Load current accurately with integrated ADC
- Output or supply voltage, FET temperature
- Provides full fault diagnostics through SPI interface and indication through FLT pin
- Detection of open load and short-to-battery
The TPS2HCS10-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI). The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection which is configurable via SPI in two ranges of thresholds. This allows sufficient flexibility to support loads that require large inrush currents, while providing improved protection. Further, the device integrates a programmable fuse profile (current versus time) that turns off the switch under persistent overload condition, thereby reducing the overhead on the MCU. These two features together allow optimization of the wire harness for any load profile with full protection.
The device supports a SPI-configurable capacitive charging mode for ECU loads in power distribution switch applications. The device also includes a low quiescent current ON-state that provides up to 800 mA of peak current while consuming about 10 µA of current.
The TPS2HCS10-Q1 device also provides a high accuracy digital current sense over SPI that allows for improved load diagnostics. By reporting load current and the channel output voltage and output FET temperature to a system MCU, the device enables diagnosis of switch and load failures.
The TPS2HCS10-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.
技術文件
設計與開發
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HSS-2HCS10EVM — 適用於智慧型保險絲高壓側開關的 TPS2HCS10-Q1 子卡
HSS-2HCS10EVM 是一個子卡,設計來和 HSS-HCMOTHERBRDEVM 搭配使用。此子卡展示德州儀器智慧型保險絲產品組合的功能。
HSS-HCMOTHERBRDEVM — Smart fuse evaluation module
The HSS-HCMOTHERBRDEVM and corresponding daughter cards (such as the HSS-2HCS10EVM) are used to showcase and evaluate all features of the Texas Instruments' smart fuse high-side switch portfolio. The motherboard is designed to be used with several different daughter cards enabling the use of a (...)
HSS-HCS-BLANKEVM — 適用於智慧保險絲開關產品組合的未組裝評估模組
HSS-SMART-CONFIGURATOR — Configuration tool for the HSS-HCMOTHERBRDEVM and TI's smart fuse high-side switches
支援產品和硬體
產品
高壓側開關
硬體開發
開發板
HCS-HEADER-FILES — C Header files for smart fuse high-side switches with register definitions
支援產品和硬體
產品
高壓側開關
硬體開發
開發板
子卡
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TIDA-020079 — 區域參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTSSOP (PWP) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。